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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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256 results
First page1245678...202122Last page
PD IEC/TR 62866:2014
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
Released: 2014-05-07
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396.00 EUR
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396.00 EUR
BS EN 61189-2-721:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
Released: 2015-06-30
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264.00 EUR
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264.00 EUR
PD IEC/TR 63017:2015
Flexible printed circuit boards (FPCBs). Method of compensation of impedance variations
Released: 2015-12-16
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189.60 EUR
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189.60 EUR
BS EN 61189-3-719:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
Released: 2016-04-30
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189.60 EUR
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189.60 EUR
BS EN 61249-4-17:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Released: 2009-10-31
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189.60 EUR
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189.60 EUR
BS IEC 62899-201:2016+A1:2018
Printed electronics Materials. Substrates
Released: 2019-01-03
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367.20 EUR
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367.20 EUR
PD IEC/TR 61189-3-914:2017
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines
Released: 2017-03-31
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264.00 EUR
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264.00 EUR
BS EN 61182-2-2:2012
Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description
Released: 2012-08-31
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348.00 EUR
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348.00 EUR
BS EN 61249-4-15:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Released: 2009-10-31
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189.60 EUR
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189.60 EUR
BS EN 61249-2-26:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Released: 2005-10-07
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264.00 EUR
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264.00 EUR
BS EN 61249-5-4:1997
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings Conductive inks
Released: 1997-05-15
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189.60 EUR
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189.60 EUR
PD IEC/PAS 61249-8-5:2014
Qualification and performance specification of permanent solder mask and flexible cover materials
Released: 2014-06-30
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264.00 EUR
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264.00 EUR
256 results
First page1245678...202122Last page