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BS EN 61191-6:2010
Printed board assemblies Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods
Printed board assemblies Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods
Released: 2010-05-31
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296.70 EUR
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296.70 EUR
BS 123800-003:2001
System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections
System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections
Released: 2001-12-17
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253.00 EUR
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253.00 EUR
BS 123200-003:2001
System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes
System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes
Released: 2001-12-17
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296.70 EUR
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296.70 EUR
English Secure PDF
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181.70 EUR
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181.70 EUR
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351.90 EUR
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351.90 EUR
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253.00 EUR
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253.00 EUR
BS CECC 23300-003:1996
Harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards
Harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards
Released: 1996-04-15
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296.70 EUR
English Secure PDF
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181.70 EUR
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181.70 EUR
BS EN 61193-1:2002
Quality assessment systems Registration and analysis of defects on printed board assemblies
Quality assessment systems Registration and analysis of defects on printed board assemblies
Released: 2002-05-14
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253.00 EUR
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253.00 EUR
PD IEC/TS 62878-2-3:2015
Device embedded substrate Guidelines. Design guide
Device embedded substrate Guidelines. Design guide
Released: 2015-04-30
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253.00 EUR
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BS IEC 62899-202-3:2019
Printed electronics Materials. Conductive ink. Measurement of sheet resistance of conductive films. Contactless method
Printed electronics Materials. Conductive ink. Measurement of sheet resistance of conductive films. Contactless method
Released: 2019-01-23
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181.70 EUR
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BS EN 61249-2-6:2003
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Released: 2006-08-31
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253.00 EUR
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253.00 EUR