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>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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256 results
First page123...151618202122Last page
BS EN IEC 61189-2-720:2024
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies Detection of defects in interconnection structures by measurement of capacitance
Released: 2024-04-17
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176.96 EUR
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176.96 EUR
BS IEC 63055:2023
Format for LSI-Package-Board Interoperable design
Released: 2023-11-08
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369.60 EUR
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369.60 EUR
BS EN IEC 61189-2-801:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Thermal conductivity test for base materials
Released: 2023-12-25
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176.96 EUR
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24/30488910 DC
BS EN IEC 61189-3-302. Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 3-302. Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
Released: 2024-03-11
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22.40 EUR
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BS EN IEC 60947-4-3:2024 - TC
Tracked Changes. Low-voltage switchgear and controlgear Contactors and motor-starters. Semiconductor controllers and semiconductor contactors for non-motor loads
Released: 2024-12-24
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517.44 EUR
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24/30506691 DC
BS IEC 62899-202-13 Printed electronics Part 202-13: Materials - Resistance measurement method for conductive layer in printed and in-mould electronics
Released: 2024-12-13
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22.40 EUR
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22.40 EUR
BS EN IEC 61189-2-809:2025
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA
Released: 2025-02-04
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25/30508747 DC
BS EN IEC 61189-3-720 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 3-720: Test methods for interconnection structures (circuit boards) - Transmission loss test method for high frequency multilayer circuit boards
Released: 2025-01-10
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22.40 EUR
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BS EN 61189-5-2:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering flux for printed board assemblies
Released: 2015-04-30
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324.80 EUR
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324.80 EUR
BS EN 61189-5-4:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
Released: 2015-04-30
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246.40 EUR
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BS EN 62326-4:1997
Printed boards Rigid multilayer printed boards with interlayer connections. Sectional specification
Released: 1997-06-15
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288.96 EUR
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288.96 EUR
PD IEC/TR 62878-2-2:2015
Device embedded substrate Guidelines. Electrical testing
Released: 2015-12-31
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176.96 EUR
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176.96 EUR
256 results
First page123...151618202122Last page