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31.180 Printed circuits and boards
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410.40 USD
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410.40 USD
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222.64 USD
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222.64 USD
BS IEC 62899-201:2016+A1:2018
Printed electronics Materials. Substrates
Printed electronics Materials. Substrates
Released: 2019-01-03
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410.40 USD
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410.40 USD
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311.15 USD
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311.15 USD
BS EN 61249-5-4:1997
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings Conductive inks
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings Conductive inks
Released: 1997-05-15
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222.64 USD
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222.64 USD
BS EN 60079-27:2008
Explosive atmospheres Fieldbus intrinsically safe concept (FISCO)
Explosive atmospheres Fieldbus intrinsically safe concept (FISCO)
Released: 2008-07-31
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222.64 USD
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PD IEC/TR 63017:2015
Flexible printed circuit boards (FPCBs). Method of compensation of impedance variations
Flexible printed circuit boards (FPCBs). Method of compensation of impedance variations
Released: 2015-12-16
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222.64 USD
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BS EN 62326-1:2002
Printed boards Generic specification
Printed boards Generic specification
Released: 2002-08-16
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431.86 USD
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431.86 USD
BS IEC 62899-204:2019
Printed electronics Materials. Insulator ink. Measurement methods of properties of insulator inks and printed insulating layers
Printed electronics Materials. Insulator ink. Measurement methods of properties of insulator inks and printed insulating layers
Released: 2019-06-07
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311.15 USD
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PD IEC TR 62878-2-8:2021
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Released: 2021-07-29
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222.64 USD
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BS EN 60097:1993
Specification for grid systems for printed circuits
Specification for grid systems for printed circuits
Released: 1993-04-15
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190.45 USD
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190.45 USD
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311.15 USD
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311.15 USD