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Main page>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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258 results
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BS EN 16602-70-60:2019
Space product assurance. Qualification and Procurement of printed circuit boards
Released: 2019-07-19
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BS EN IEC 61249-2-46:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2018-04-16
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BS EN IEC 61249-2-45:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2018-04-13
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BS EN IEC 61191-1:2018 - TC
Tracked Changes. Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Released: 2020-02-27
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581.76 USD
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BS EN 61191-3:2017 - TC
Tracked Changes. Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
Released: 2020-02-26
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441.06 USD
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BS EN 61249-2-38:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2009-06-30
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BS EN 61249-2-12:1999
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Epoxide non-woven aramid laminate of defined flammability, copper-clad
Released: 1999-06-15
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BS EN 62326-4-1:1997
Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification Capability detail specification. Performance levels, A, B and C
Released: 1997-06-15
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BS EN 61189-5-1:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
Released: 2016-10-31
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BS EN 123500:1992
Specification for harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards with through connections
Released: 1990-11-30
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368.00 USD
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BS EN 61249-4-1:2008
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Epoxide woven E-glass prepreg of defined flammability
Released: 2008-07-31
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BS EN 61188-5-4:2007
Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides
Released: 2007-12-31
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258 results
First page123...579...202122Last page