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31.180 Printed circuits and boards
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PRICES include / exclude VAT
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Price exclude VAT will be charged for customers of European Union – VAT payers (with valid EU VAT number) and for customers outside of European Union.
BS 123800-003:2001
System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections
System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections
Released: 2001-12-17
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313.88 USD
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313.88 USD
BS EN 61188-5-4:2007
Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides
Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides
Released: 2007-12-31
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224.59 USD
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224.59 USD
BS EN 123500-800:1992
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections
Released: 1991-12-20
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224.59 USD
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BS 123200-003:2001
System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes
System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes
Released: 2001-12-17
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368.00 USD
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368.00 USD
PD IEC/PAS 61182-12:2014
Generic requirements for printed board assembly products manufacturing description data and transfer methodology
Generic requirements for printed board assembly products manufacturing description data and transfer methodology
Released: 2014-10-31
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470.82 USD
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470.82 USD
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470.82 USD
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470.82 USD
BS IEC 62899-302-2:2018
Printed electronics Equipment. Inkjet. Imaging-based measurement of droplet volume
Printed electronics Equipment. Inkjet. Imaging-based measurement of droplet volume
Released: 2018-05-18
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224.59 USD
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BS CECC 23300-003:1996
Harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards
Harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards
Released: 1996-04-15
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368.00 USD
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368.00 USD
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224.59 USD
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224.59 USD
BS EN 61193-1:2002
Quality assessment systems Registration and analysis of defects on printed board assemblies
Quality assessment systems Registration and analysis of defects on printed board assemblies
Released: 2002-05-14
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313.88 USD
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313.88 USD
PD IEC/TS 62878-2-3:2015
Device embedded substrate Guidelines. Design guide
Device embedded substrate Guidelines. Design guide
Released: 2015-04-30
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313.88 USD
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313.88 USD
English Secure PDF
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Printable - You are authorized to print 1 copy
313.88 USD
English Hardcopy
In stock
313.88 USD