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>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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258 results
First page1245678...202122Last page
BS 123700-003:2001
System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections
Released: 2001-12-17
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BS EN 61188-5-2:2003
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components
Released: 2003-10-16
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431.86 USD
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BS EN 61249-4-15:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Released: 2009-10-31
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222.64 USD
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PD IEC/TS 62878-2-1:2015
Device embedded substrate Guidelines. General description of technology
Released: 2015-04-30
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364.80 USD
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BS EN 62326-20:2016
Printed boards Printed circuit boards for high-brightness LEDs
Released: 2016-05-31
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BS EN 61249-2-37:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2009-04-30
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BS EN 61249-2-18:2002
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper clad
Released: 2002-05-10
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BS 6221-6:1982
Printed wiring boards Specification for multilayer printed wiring boards
Released: 1982-01-29
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BS EN 61249-2-30:2013
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
Released: 2013-04-30
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BS EN 61249-2-27:2013
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
Released: 2013-04-30
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BS EN 61249-4-18:2013
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Released: 2014-02-28
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PD IEC/TR 61189-3-914:2017
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines
Released: 2017-03-31
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258 results
First page1245678...202122Last page