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31.180 Printed circuits and boards
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313.88 USD
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313.88 USD
BS EN 61188-5-3:2007
Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on two sides
Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on two sides
Released: 2007-12-31
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BS 123700-003:2001
System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections
System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections
Released: 2001-12-17
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BS EN 61188-5-2:2003
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components
Released: 2003-10-16
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435.65 USD
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BS EN 60097:1993
Specification for grid systems for printed circuits
Specification for grid systems for printed circuits
Released: 1993-04-15
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192.12 USD
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192.12 USD
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313.88 USD
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BS EN 62326-1:2002
Printed boards Generic specification
Printed boards Generic specification
Released: 2002-08-16
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PD IEC TR 61188-8:2021
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
Released: 2021-01-22
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224.59 USD
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BS IEC 62899-202-7:2021
Printed electronics Materials. Printed film. Measurement of peel strength for printed layer on flexible substrate by the 90° peel method
Printed electronics Materials. Printed film. Measurement of peel strength for printed layer on flexible substrate by the 90° peel method
Released: 2021-03-11
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BS EN IEC 63251:2023
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
Released: 2023-12-19
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192.12 USD
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PD IEC TR 62878-2-8:2021
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Released: 2021-07-29
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