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>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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258 results
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BS EN 61249-4-12:2005
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Non-halogenated multifuctional epoxide woven E-glass prepeg of defined flammability
Released: 2006-02-01
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DD IEC/PAS 61249-3-1:2007
Materials for printed boards and other interconnecting structures Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
Released: 2007-10-31
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BS EN 61249-2-36:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2009-06-30
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BS EN 61249-2-19:2002
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Epoxide cross-plied linear fibreglass-reinforced laminated sheets of defined flammability (vertical burning test) copper clad
Released: 2002-05-02
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BS EN 123000/Add:1997
Harmonized system of quality assessment for electronic components. Generic specification: printed boards
Released: 1997-08-15
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327.25 USD
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BS EN IEC 61188-6-4:2019
Printed boards and printed board assemblies. Design and use Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
Released: 2019-07-12
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410.40 USD
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PD IEC TR 62878-2-7:2019
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
Released: 2019-04-01
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BS EN IEC 62878-1:2019
Device embedding assembly technology Generic specification for device embedded substrates
Released: 2019-12-17
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BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Released: 2021-08-20
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PD IEC TR 61191-8:2021
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Released: 2021-03-25
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BS EN IEC 61189-5-502:2021
Test methods for electrical materials, printed board and other interconnection structures and assemblies General test methods for materials and assemblies. Surface insulation resistance (SIR) testing of assemblies
Released: 2021-03-18
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PD IEC TR 62899-250:2025
Printed electronics Material technologies required in printed electronics for wearable smart devices
Released: 2025-03-17
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258 results
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