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31.180 Printed circuits and boards
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313.88 USD
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313.88 USD
BS EN 62326-4:1997
Printed boards Rigid multilayer printed boards with interlayer connections. Sectional specification
Printed boards Rigid multilayer printed boards with interlayer connections. Sectional specification
Released: 1997-06-15
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368.00 USD
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368.00 USD
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313.88 USD
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BS EN 61188-5-5:2007
Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on four sides
Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on four sides
Released: 2007-12-31
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414.00 USD
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414.00 USD
19/30357467 DC
BS IEC 62899-201-2. Printed electronics Part 201-2. Materials. Evaluation method of stretchable substrates
BS IEC 62899-201-2. Printed electronics Part 201-2. Materials. Evaluation method of stretchable substrates
Released: 2019-05-13
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27.06 USD
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DD IEC/PAS 61249-3-1:2007
Materials for printed boards and other interconnecting structures Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
Materials for printed boards and other interconnecting structures Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
Released: 2007-10-31
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313.88 USD
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224.59 USD
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224.59 USD
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224.59 USD
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PD IEC TS 62878-2-10:2024
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
Released: 2024-02-07
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192.12 USD
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BS IEC 62899-202-4:2021
Printed electronics Materials. Conductive ink. Measurement methods for properties of stretchable printed layers (conductive and insulating)
Printed electronics Materials. Conductive ink. Measurement methods for properties of stretchable printed layers (conductive and insulating)
Released: 2021-12-24
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BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Released: 2021-08-20
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BS IEC 62899-202:2023 - TC
Tracked Changes. Printed electronics Materials. Conductive ink
Tracked Changes. Printed electronics Materials. Conductive ink
Released: 2023-06-08
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516.82 USD
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516.82 USD