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>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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258 results
First page123...151617182022Last page
BS CECC 23200-003:1996
Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plated through holes
Released: 1996-04-15
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311.15 USD
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PD IEC/TR 62878-2-2:2015
Device embedded substrate Guidelines. Electrical testing
Released: 2015-12-31
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222.64 USD
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BS EN 61189-5-2:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering flux for printed board assemblies
Released: 2015-04-30
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BS EN 61189-5-4:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
Released: 2015-04-30
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BS EN 62326-4:1997
Printed boards Rigid multilayer printed boards with interlayer connections. Sectional specification
Released: 1997-06-15
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364.80 USD
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BS EN 61249-4-14:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Released: 2009-10-31
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BS EN 123400:1992
Harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards without through connections
Released: 1990-12-31
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19/30357467 DC
BS IEC 62899-201-2. Printed electronics Part 201-2. Materials. Evaluation method of stretchable substrates
Released: 2019-05-13
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26.82 USD
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BS EN 61249-2-22:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Released: 2005-08-24
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BS EN 61249-4-16:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Released: 2009-10-31
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BS EN 61249-2-35:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2009-04-30
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BS EN 61188-5-5:2007
Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on four sides
Released: 2007-12-31
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410.40 USD
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258 results
First page123...151617182022Last page