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BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Released: 2021-08-20
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176.96 EUR
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176.96 EUR
PD IEC TR 61191-8:2021
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Released: 2021-03-25
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288.96 EUR
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288.96 EUR
English Secure PDF
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246.40 EUR
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246.40 EUR
BS IEC 62899-202:2023 - TC
Tracked Changes. Printed electronics Materials. Conductive ink
Tracked Changes. Printed electronics Materials. Conductive ink
Released: 2023-06-08
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405.44 EUR
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405.44 EUR