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264.00 EUR
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264.00 EUR
BS EN IEC 61189-2-805:2024
Test methods for electrical materials, printed boards and other interconnection structures and assemblies X/Y CTE test for thin base materials by TMA
Test methods for electrical materials, printed boards and other interconnection structures and assemblies X/Y CTE test for thin base materials by TMA
Released: 2024-05-30
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160.80 EUR
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160.80 EUR
BS EN IEC 63203-401-1:2023
Wearable electronic devices and technologies Devices and systems: functional elements. Evaluation method of the stretchable resistive strain sensor
Wearable electronic devices and technologies Devices and systems: functional elements. Evaluation method of the stretchable resistive strain sensor
Released: 2023-11-30
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348.00 EUR
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348.00 EUR
English Secure PDF
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189.60 EUR
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189.60 EUR
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264.00 EUR
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264.00 EUR
PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Released: 2022-08-23
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BS IEC 62899-201-2:2021
Printed electronics Materials. Substrates. Measurement methods for properties of stretchable substrates
Printed electronics Materials. Substrates. Measurement methods for properties of stretchable substrates
Released: 2022-04-06
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25/30507775 DC
BS IEC 62899-202-14 Printed electronics Part 202-14: Materials - Test methods of conductive ink suitability for screen printing
BS IEC 62899-202-14 Printed electronics Part 202-14: Materials - Test methods of conductive ink suitability for screen printing
Released: 2024-12-20
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24.00 EUR
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24.00 EUR
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24.00 EUR
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25/30510920 DC
Draft BS EN 62899-202-12 Ed.1.0 Printed electronics : Materials. Rheological property measurement methods of inkjet ink for printed electronics
Draft BS EN 62899-202-12 Ed.1.0 Printed electronics : Materials. Rheological property measurement methods of inkjet ink for printed electronics
Released: 2025-02-25
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BS IEC 62899-202-11:2025
Printed electronics Materials. Conductive ink. Measurement method of electrical resistance uniformity for large area printed conductive layer
Printed electronics Materials. Conductive ink. Measurement method of electrical resistance uniformity for large area printed conductive layer
Released: 2025-04-30
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BS EN IEC 62878-2-603:2025
Device embedding assembly technology Guideline for stacked electronic module. Test method of intra-module electrical connectivity
Device embedding assembly technology Guideline for stacked electronic module. Test method of intra-module electrical connectivity
Released: 2025-04-16
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