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>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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256 results
1345678...202122Last page
PD IEC/TS 62878-2-1:2015
Device embedded substrate Guidelines. General description of technology
Released: 2015-04-30
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288.96 EUR
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288.96 EUR
BS EN 61249-4-11:2005
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Non-halogenated epoxide woven E-glass prepeg of defined flammability
Released: 2006-02-01
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176.96 EUR
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176.96 EUR
BS EN 62326-20:2016
Printed boards Printed circuit boards for high-brightness LEDs
Released: 2016-05-31
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342.72 EUR
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342.72 EUR
BS EN 61249-2-37:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2009-04-30
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246.40 EUR
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246.40 EUR
BS EN 61249-2-30:2013
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
Released: 2013-04-30
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246.40 EUR
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246.40 EUR
BS EN 61249-2-27:2013
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
Released: 2013-04-30
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246.40 EUR
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246.40 EUR
BS EN 61249-4-18:2013
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Released: 2014-02-28
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176.96 EUR
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176.96 EUR
PD IEC/TR 61189-3-914:2017
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines
Released: 2017-03-31
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246.40 EUR
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246.40 EUR
BS EN 61182-2-2:2012
Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description
Released: 2012-08-31
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324.80 EUR
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324.80 EUR
BS EN 61249-4-15:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Released: 2009-10-31
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176.96 EUR
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176.96 EUR
BS EN 61249-4-17:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Released: 2009-10-31
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176.96 EUR
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176.96 EUR
PD IEC/PAS 61249-8-5:2014
Qualification and performance specification of permanent solder mask and flexible cover materials
Released: 2014-06-30
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246.40 EUR
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246.40 EUR
256 results
1345678...202122Last page