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>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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256 results
1345678...202122Last page
BS EN 61191-3:2017
Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
Released: 2017-09-25
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246.40 EUR
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246.40 EUR
BS EN 61249-2-13:1999
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Cyanate ester non-woven aramid laminate of defined flammability, copper-clad
Released: 1999-06-15
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176.96 EUR
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176.96 EUR
BS EN 61189-1:1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods and methodology
Released: 2002-06-21
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246.40 EUR
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246.40 EUR
PD IEC/TS 62878-2-4:2015
Device embedded substrate Guidelines. Test element groups (TEG)
Released: 2015-04-30
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288.96 EUR
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288.96 EUR
BS EN 61249-3-4:1999
Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) Adhesive coated flexible polyimide film
Released: 1999-06-15
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176.96 EUR
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176.96 EUR
BS EN 61249-3-5:1999
Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) Transfer adhesive films for flexible printed boards
Released: 1999-06-15
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176.96 EUR
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176.96 EUR
BS CECC 200025:1998
Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities
Released: 1998-08-15
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288.96 EUR
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288.96 EUR
BS EN 61189-3-719:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
Released: 2016-04-30
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176.96 EUR
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176.96 EUR
BS EN 61249-4-15:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Released: 2009-10-31
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176.96 EUR
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176.96 EUR
PD IEC/TS 62878-2-1:2015
Device embedded substrate Guidelines. General description of technology
Released: 2015-04-30
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288.96 EUR
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288.96 EUR
BS EN 61249-4-17:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Released: 2009-10-31
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176.96 EUR
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176.96 EUR
PD IEC/PAS 61249-8-5:2014
Qualification and performance specification of permanent solder mask and flexible cover materials
Released: 2014-06-30
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246.40 EUR
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246.40 EUR
256 results
1345678...202122Last page