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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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256 results
First page123...151618202122Last page
25/30508747 DC
BS EN IEC 61189-3-720 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 3-720: Test methods for interconnection structures (circuit boards) - Transmission loss test method for high frequency multilayer circuit boards
Released: 2025-01-10
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23.00 EUR
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23.00 EUR
BS EN IEC 60947-4-3:2024 - TC
Tracked Changes. Low-voltage switchgear and controlgear Contactors and motor-starters. Semiconductor controllers and semiconductor contactors for non-motor loads
Released: 2024-12-24
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531.30 EUR
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531.30 EUR
24/30506691 DC
BS IEC 62899-202-13 Printed electronics Part 202-13: Materials - Resistance measurement method for conductive layer in printed and in-mould electronics
Released: 2024-12-13
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23.00 EUR
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23.00 EUR
BS EN IEC 61189-2-809:2025
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA
Released: 2025-02-04
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154.10 EUR
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154.10 EUR
24/30488910 DC
BS EN IEC 61189-3-302. Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 3-302. Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
Released: 2024-03-11
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23.00 EUR
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23.00 EUR
24/30499551 DC
BS EN IEC 63516 Fixed folding durability test method for flexible opto-electric circuit boards
Released: 2024-08-23
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23.00 EUR
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23.00 EUR
BS EN 61249-4-16:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Released: 2009-10-31
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181.70 EUR
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181.70 EUR
BS EN 61249-4-14:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Released: 2009-10-31
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181.70 EUR
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181.70 EUR
BS EN 123400:1992
Harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards without through connections
Released: 1990-12-31
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253.00 EUR
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253.00 EUR
BS EN 61249-2-22:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Released: 2005-08-24
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253.00 EUR
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253.00 EUR
19/30357467 DC
BS IEC 62899-201-2. Printed electronics Part 201-2. Materials. Evaluation method of stretchable substrates
Released: 2019-05-13
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23.00 EUR
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23.00 EUR
BS EN IEC 61191-1:2018
Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Released: 2018-11-13
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333.50 EUR
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333.50 EUR
256 results
First page123...151618202122Last page