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Homepage>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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257 results
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BS EN 61191-3:2017
Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
Released: 2017-09-25
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255.20 EUR
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255.20 EUR
BS EN 61189-3-719:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
Released: 2016-04-30
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183.28 EUR
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183.28 EUR
BS EN 61249-5-4:1997
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings Conductive inks
Released: 1997-05-15
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183.28 EUR
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183.28 EUR
BS IEC 62899-201:2016+A1:2018
Printed electronics Materials. Substrates
Released: 2019-01-03
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354.96 EUR
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354.96 EUR
BS EN 61249-2-26:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Released: 2005-10-07
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255.20 EUR
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255.20 EUR
BS 6221-6:1982
Printed wiring boards Specification for multilayer printed wiring boards
Released: 1982-01-29
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255.20 EUR
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255.20 EUR
BS EN 61249-2-30:2013
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
Released: 2013-04-30
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255.20 EUR
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255.20 EUR
BS EN 61249-2-27:2013
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
Released: 2013-04-30
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255.20 EUR
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255.20 EUR
BS EN 61249-4-18:2013
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Released: 2014-02-28
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183.28 EUR
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183.28 EUR
PD IEC/TR 61189-3-914:2017
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines
Released: 2017-03-31
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255.20 EUR
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255.20 EUR
BS EN 61182-2-2:2012
Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description
Released: 2012-08-31
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336.40 EUR
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336.40 EUR
BS EN 61249-4-17:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Released: 2009-10-31
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183.28 EUR
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183.28 EUR
257 results
1345678...202122Last page