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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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257 results
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BS 123800-003:2001
System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections
Released: 2001-12-17
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264.00 EUR
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264.00 EUR
BS EN IEC 61249-2-46:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2018-04-16
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264.00 EUR
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264.00 EUR
BS EN IEC 61249-2-45:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2018-04-13
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264.00 EUR
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264.00 EUR
BS 6221-1:1990
Printed wiring boards Guide for the specification writer
Released: 1990-02-28
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160.80 EUR
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160.80 EUR
BS EN 61249-2-8:2003
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Reinforced base materials clad and unclad. Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Released: 2003-08-14
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264.00 EUR
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264.00 EUR
BS EN 16602-70-60:2019
Space product assurance. Qualification and Procurement of printed circuit boards
Released: 2019-07-19
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396.00 EUR
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396.00 EUR
BS EN IEC 61191-1:2018 - TC
Tracked Changes. Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Released: 2020-02-27
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487.20 EUR
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487.20 EUR
BS EN 61191-3:2017 - TC
Tracked Changes. Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
Released: 2020-02-26
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369.60 EUR
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369.60 EUR
BS EN IEC 61189-5-601:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
Released: 2021-03-19
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348.00 EUR
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348.00 EUR
BS EN IEC 61188-6-1:2021
Circuit boards and circuit board assemblies. Design and use Land pattern design. Generic requirements for land pattern on circuit boards
Released: 2021-04-07
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309.60 EUR
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309.60 EUR
23/30474274 DC
BS EN IEC 63267-3-81. Fibre optic interconnecting devices and passive components. Connector optical interfaces for enhanced Macro bend multimode fibre Part 3-81. Connector parameters of physically contacting 50 μm core diameter fibres. Non-angled polyphenylene sulphide rectangular ferrules with a single row of 12, 8, 4, or 2 fibres for reference connector applications
Released: 2023-05-26
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24.00 EUR
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24.00 EUR
BS EN IEC 61249-2-51:2023
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Base materials for integrated circuit card carrier tape, unclad
Released: 2023-06-22
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189.60 EUR
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189.60 EUR
257 results
First page123...6810...202122Last page