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Homepage>BS Standards>31 ELECTRONICS>31.190 Electronic component assemblies

31.190 Electronic component assemblies

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80 results
First page12467Last page
BS EN IEC 61190-1-3:2018 - TC
Tracked Changes. Attachment materials for electronic assembly Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Released: 2020-02-27
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466.90 EUR
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466.90 EUR
BS EN IEC 61188-6-2:2021
Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for the most common surface mounted components (SMD)
Released: 2021-03-19
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253.00 EUR
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253.00 EUR
21/30439434 DC
BS EN IEC 63215-5. Endurance test methods for die attach materials Part 5. Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices
Released: 2021-12-03
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23.00 EUR
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23.00 EUR
PD IEC TR 61191-7:2020
Printed board assemblies Technical cleanliness of components and printed board assemblies
Released: 2020-03-23
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379.50 EUR
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379.50 EUR
BS EN IEC 60068-2-82:2019 - TC
Tracked Changes. Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies
Released: 2020-02-24
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416.30 EUR
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416.30 EUR
PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Released: 2022-08-23
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181.70 EUR
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181.70 EUR
BS EN 62137-4:2014
Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
Released: 2015-06-30
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333.50 EUR
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333.50 EUR
BS EN IEC 62878-2-5:2019
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
Released: 2019-11-18
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351.90 EUR
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351.90 EUR
BS EN IEC 61190-1-3:2018
Attachment materials for electronic assembly Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Released: 2018-03-28
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333.50 EUR
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333.50 EUR
BS EN 62739-2:2016
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials with surface processing
Released: 2016-10-31
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181.70 EUR
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181.70 EUR
BS EN 61188-1-1:1997
Printed boards and assemblies. Design and use. Generic requirements Flatness considerations for electronic assemblies
Released: 1997-12-15
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154.10 EUR
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154.10 EUR
BS EN 60939-2-2:2004
Complete filter units for radio interference suppression Blank detail specification. Passive filter units for electromagnetic interference suppression. Filters for which safety tests are required (safety tests only)
Released: 2005-02-08
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181.70 EUR
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181.70 EUR
80 results
First page12467Last page