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31.190 Electronic component assemblies
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BS EN IEC 62435-9:2021
Electronic components. Long-term storage of electronic semiconductor devices Special cases
Electronic components. Long-term storage of electronic semiconductor devices Special cases
Released: 2021-10-11
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222.64 USD
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311.15 USD
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24/30502381 DC
BS EN IEC 61760-4 Surface mounting technology Part 4: Classification, packaging, labelling and handling of moisture sensitive devices ED2
BS EN IEC 61760-4 Surface mounting technology Part 4: Classification, packaging, labelling and handling of moisture sensitive devices ED2
Released: 2024-10-18
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26.82 USD
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26.82 USD
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222.64 USD
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BS EN 61760-4:2015+A1:2018
Surface mounting technology Classification, packaging, labelling and handling of moisture sensitive devices
Surface mounting technology Classification, packaging, labelling and handling of moisture sensitive devices
Released: 2020-06-16
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364.80 USD
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BS EN 61188-1-2:1998
Printed boards and assemblies. Design and use. Generic requirements Generic requirements. Controlled impedance
Printed boards and assemblies. Design and use. Generic requirements Generic requirements. Controlled impedance
Released: 1998-12-15
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BS EN 62739-1:2013
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials without surface processing
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials without surface processing
Released: 2013-09-30
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BS EN 62878-1-1:2015
Device embedded substrate Generic specification. Test methods
Device embedded substrate Generic specification. Test methods
Released: 2015-07-31
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431.86 USD
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PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Released: 2022-08-23
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BS EN 61193-3:2013
Quality assessment systems Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
Quality assessment systems Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
Released: 2013-06-30
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BS EN 61190-1-1:2002
Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly
Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly
Released: 2002-08-16
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BS EN 62421:2007
Electronics assembly technology. Electronic modules
Electronics assembly technology. Electronic modules
Released: 2007-12-31
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222.64 USD
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