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Main page>BSI Standards >31 ELECTRONICS>31.190 Electronic component assemblies

31.190 Electronic component assemblies

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BS EN IEC 61188-6-4:2019
Printed boards and printed board assemblies. Design and use Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
Released: 2019-07-12
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BS EN 61188-5-6:2003
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides
Released: 2003-06-26
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PD IEC TR 62878-2-7:2019
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
Released: 2019-04-01
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BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Released: 2021-08-20
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BS EN IEC 62878-1:2019
Device embedding assembly technology Generic specification for device embedded substrates
Released: 2019-12-17
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BS EN 60068-2-69:2017+A1:2019
Environmental testing Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Released: 2019-09-11
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PD IEC TR 61191-8:2021
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Released: 2021-03-25
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PD IEC TR 60068-3-12:2022 - TC
Tracked Changes. Environmental testing Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile
Released: 2022-12-20
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PD IEC TR 60068-3-12:2022
Environmental testing Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile
Released: 2022-11-30
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22/30383603 DC
BS IEC 63215-4. Endurance test methods for die attach materials applied to power electronic devices Part 4. Power cycling test method for die attach materials (near chip interconnection) applied to module type power electronic devices
Released: 2022-12-15
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BS EN IEC 60068-2-83:2025 - TC
Tracked Changes. Environmental testing Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
Released: 2025-08-14
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PD IEC TR 61760-5-1:2024
Surface mounting technology Surface strain on circuit board. Strain gauge measurement applied to chip components
Released: 2024-02-07
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