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BS EN 62137-1-1:2007
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength test
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength test
Released: 2007-10-31
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224.59 USD
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BS EN 62137-1-3:2009
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop test
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop test
Released: 2009-03-31
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313.88 USD
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DD IEC/PAS 62588:2008
Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes
Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes
Released: 2008-10-31
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PD IEC TR 62878-2-7:2019
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
Released: 2019-04-01
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BS EN 61188-5-6:2003
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides
Released: 2003-06-26
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BS EN IEC 62878-1:2019
Device embedding assembly technology Generic specification for device embedded substrates
Device embedding assembly technology Generic specification for device embedded substrates
Released: 2019-12-17
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435.65 USD
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435.65 USD
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414.00 USD
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414.00 USD
BS EN 62739-3:2017
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Selection guidance of erosion test methods
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Selection guidance of erosion test methods
Released: 2017-04-30
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368.00 USD
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BS EN IEC 61188-6-3:2025
Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for through hole components (THT)
Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for through hole components (THT)
Released: 2025-02-04
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368.00 USD
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24/30498340 DC
BS EN IEC 61869-3 Instrument transformers Additional requirements for inductive voltage transformers
BS EN IEC 61869-3 Instrument transformers Additional requirements for inductive voltage transformers
Released: 2024-08-02
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27.06 USD
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PD IEC TR 61760-5-1:2024
Surface mounting technology Surface strain on circuit board. Strain gauge measurement applied to chip components
Surface mounting technology Surface strain on circuit board. Strain gauge measurement applied to chip components
Released: 2024-02-07
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