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Main page>BSI Standards >31 ELECTRONICS>31.190 Electronic component assemblies

31.190 Electronic component assemblies

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90 results
First page124678Last page
BS EN 61188-1-2:1998
Printed boards and assemblies. Design and use. Generic requirements Generic requirements. Controlled impedance
Released: 1998-12-15
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BS EN 60939-2-1:2004
Complete filter units for radio interference suppression Blank detail specification. Passive filter units for electromagnetic interference suppression. Filters for which safety tests are required (Assessment level D/DZ)
Released: 2005-02-09
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BS EN 62878-1-1:2015
Device embedded substrate Generic specification. Test methods
Released: 2015-07-31
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BS EN 62739-1:2013
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials without surface processing
Released: 2013-09-30
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BS EN 61760-4:2015+A1:2018
Surface mounting technology Classification, packaging, labelling and handling of moisture sensitive devices
Released: 2020-06-16
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BS EN IEC 61188-6-2:2021
Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for the most common surface mounted components (SMD)
Released: 2021-03-19
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BS EN IEC 62878-2-603:2025
Device embedding assembly technology Guideline for stacked electronic module. Test method of intra-module electrical connectivity
Released: 2025-04-16
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PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Released: 2022-08-23
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BS EN IEC 60068-2-88:2025
Environmental testing Tests. Test XD: Resistance of components and assemblies to liquid cleaning media
Released: 2025-08-12
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25/30510987 DC
Draft BS EN 61249-2-55 Materials for printed boards and other interconnecting structures Part 2-55. Reinforced base materials clad and unclad. Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad
Released: 2025-07-21
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26/30511576 DC
BS EN IEC 63609-3 Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements Part 3: Determination for temperature measurement in miniaturised surface mounting devices using thermocouples
Released: 2026-01-09
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PD IEC PAS 63720:2026
Rigid circuit board. Routing parameters
Released: 2026-08-14
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90 results
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