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31.190 Electronic component assemblies
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581.76 USD
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581.76 USD
PD IEC TR 61191-7:2020
Printed board assemblies Technical cleanliness of components and printed board assemblies
Printed board assemblies Technical cleanliness of components and printed board assemblies
Released: 2020-03-23
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470.82 USD
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470.82 USD
BS EN 61190-1-1:2002
Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly
Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly
Released: 2002-08-16
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313.88 USD
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313.88 USD
BS EN 62421:2007
Electronics assembly technology. Electronic modules
Electronics assembly technology. Electronic modules
Released: 2007-12-31
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224.59 USD
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224.59 USD
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313.88 USD
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313.88 USD
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27.06 USD
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27.06 USD
PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Released: 2022-08-23
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BS EN IEC 62878-2-603:2025
Device embedding assembly technology Guideline for stacked electronic module. Test method of intra-module electrical connectivity
Device embedding assembly technology Guideline for stacked electronic module. Test method of intra-module electrical connectivity
Released: 2025-04-16
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224.59 USD
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BS EN IEC 60068-2-88:2025
Environmental testing Tests. Test XD: Resistance of components and assemblies to liquid cleaning media
Environmental testing Tests. Test XD: Resistance of components and assemblies to liquid cleaning media
Released: 2025-08-12
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368.00 USD
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368.00 USD
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27.06 USD
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27.06 USD
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27.06 USD
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27.06 USD
BS EN 62090:2017
Product package labels for electronic components using bar code and two- dimensional symbologies
Product package labels for electronic components using bar code and two- dimensional symbologies
Released: 2017-07-31
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368.00 USD
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368.00 USD