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>BSI Standards >31 ELECTRONICS>31.190 Electronic component assemblies

31.190 Electronic component assemblies

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87 results
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BS EN IEC 61190-1-3:2018 - TC
Tracked Changes. Attachment materials for electronic assembly Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Released: 2020-02-27
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PD IEC TR 61191-7:2020
Printed board assemblies Technical cleanliness of components and printed board assemblies
Released: 2020-03-23
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BS EN IEC 61188-6-2:2021
Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for the most common surface mounted components (SMD)
Released: 2021-03-19
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21/30439434 DC
BS EN IEC 63215-5. Endurance test methods for die attach materials Part 5. Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices
Released: 2021-12-03
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PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Released: 2022-08-23
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BS EN IEC 62878-2-603:2025
Device embedding assembly technology Guideline for stacked electronic module. Test method of intra-module electrical connectivity
Released: 2025-04-16
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25/30510987 DC
Draft BS EN 61249-2-55 Materials for printed boards and other interconnecting structures Part 2-55. Reinforced base materials clad and unclad. Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad
Released: 2025-07-21
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BS EN IEC 60068-2-88:2025
Environmental testing Tests. Test XD: Resistance of components and assemblies to liquid cleaning media
Released: 2025-08-12
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26/30511576 DC
BS EN IEC 63609-3 Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements Part 3: Determination for temperature measurement in miniaturised surface mounting devices using thermocouples
Released: 2026-01-09
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BS EN 62137-4:2014
Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
Released: 2015-06-30
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BS EN 62739-2:2016
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials with surface processing
Released: 2016-10-31
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BS EN 61188-1-1:1997
Printed boards and assemblies. Design and use. Generic requirements Flatness considerations for electronic assemblies
Released: 1997-12-15
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87 results
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