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31.190 Electronic component assemblies
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228.49 USD
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BS EN 61188-1-1:1997
Printed boards and assemblies. Design and use. Generic requirements Flatness considerations for electronic assemblies
Printed boards and assemblies. Design and use. Generic requirements Flatness considerations for electronic assemblies
Released: 1997-12-15
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195.46 USD
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BS EN 62137-4:2014
Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
Released: 2015-06-30
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421.20 USD
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421.20 USD
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421.20 USD
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BS EN 62739-2:2016
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials with surface processing
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials with surface processing
Released: 2016-10-31
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BS EN 62090:2017
Product package labels for electronic components using bar code and two- dimensional symbologies
Product package labels for electronic components using bar code and two- dimensional symbologies
Released: 2017-07-31
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374.40 USD
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BS EN 62129-2:2011
Calibration of wavelength/optical frequency measurement instruments Michelson interferometer single wavelength meters
Calibration of wavelength/optical frequency measurement instruments Michelson interferometer single wavelength meters
Released: 2011-07-31
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443.22 USD
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BS EN 60194:2006
Printed board design, manufacture and assembly. Terms and definitions
Printed board design, manufacture and assembly. Terms and definitions
Released: 2006-09-29
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479.01 USD
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BS EN IEC 60068-2-21:2021
Environmental testing Tests. Test U: Robustness of terminations and integral mounting devices
Environmental testing Tests. Test U: Robustness of terminations and integral mounting devices
Released: 2021-09-13
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BS EN IEC 62878-2-5:2019
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
Released: 2019-11-18
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PD IEC PAS 61191-10:2022
Printed board assemblies Application and utilization of protective coatings for electronic assemblies
Printed board assemblies Application and utilization of protective coatings for electronic assemblies
Released: 2022-09-13
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479.01 USD
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479.01 USD
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479.01 USD