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PD IEC TR 61188-8:2021
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
Released: 2021-01-22
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PD IEC TR 62878-2-8:2021
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Released: 2021-07-29
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228.49 USD
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27.53 USD
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27.53 USD
BS EN IEC 61760-4:2026 - TC
Tracked Changes. Surface mounting technology Classification, packaging, labelling and handling of moisture sensitive devices
Tracked Changes. Surface mounting technology Classification, packaging, labelling and handling of moisture sensitive devices
Released: 2026-08-04
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525.81 USD
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525.81 USD
BS EN 62137-1-5:2009
Surface mounting technology. Environmental and endurance test methods for surface mount solder joints Mechanical shear fatigue test
Surface mounting technology. Environmental and endurance test methods for surface mount solder joints Mechanical shear fatigue test
Released: 2009-07-31
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319.34 USD
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BS EN 62417:2010
Semiconductor devices. Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
Semiconductor devices. Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
Released: 2010-06-30
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195.46 USD
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BS EN 61193-1:2002
Quality assessment systems Registration and analysis of defects on printed board assemblies
Quality assessment systems Registration and analysis of defects on printed board assemblies
Released: 2002-05-14
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319.34 USD
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PD IEC/TS 62878-2-3:2015
Device embedded substrate Guidelines. Design guide
Device embedded substrate Guidelines. Design guide
Released: 2015-04-30
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319.34 USD
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319.34 USD
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319.34 USD
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319.34 USD
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591.88 USD
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591.88 USD
BS EN IEC 61760-3:2021
Surface mounting technology Standard method for the specification of components for through-hole reflow (THR) soldering
Surface mounting technology Standard method for the specification of components for through-hole reflow (THR) soldering
Released: 2021-03-18
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374.40 USD
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BS EN IEC 62435-9:2021
Electronic components. Long-term storage of electronic semiconductor devices Special cases
Electronic components. Long-term storage of electronic semiconductor devices Special cases
Released: 2021-10-11
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