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31.180 Printed circuits and boards
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224.59 USD
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313.88 USD
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BS EN 60191-6-16:2007
Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Released: 2007-07-31
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192.12 USD
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BS CECC 23300-801:1998
Harmonized system of quality assessment for electronic components. Capability detail specification: multi-layer printed boards
Harmonized system of quality assessment for electronic components. Capability detail specification: multi-layer printed boards
Released: 1998-06-15
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368.00 USD
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BS EN 61249-2-2:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Released: 2006-06-30
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BS 123300:2001
System of quality assessment. Sectional specification. Rigid multilayer printed boards
System of quality assessment. Sectional specification. Rigid multilayer printed boards
Released: 2001-12-17
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PD IEC TR 61191-7:2020
Printed board assemblies Technical cleanliness of components and printed board assemblies
Printed board assemblies Technical cleanliness of components and printed board assemblies
Released: 2020-03-23
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470.82 USD
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BS 123500:2001
System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards with through-connections
System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards with through-connections
Released: 2001-12-17
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English Secure PDF
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313.88 USD
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313.88 USD
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313.88 USD
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BS IEC 62899-402-3:2021
Printed electronics Printability. Measurement of qualities. Voids in printed pattern using a two-dimensional optical image
Printed electronics Printability. Measurement of qualities. Voids in printed pattern using a two-dimensional optical image
Released: 2021-04-22
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