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31.180 Printed circuits and boards
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PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Released: 2022-08-23
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222.64 USD
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222.64 USD
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311.15 USD
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311.15 USD
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437.22 USD
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437.22 USD
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222.64 USD
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222.64 USD
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311.15 USD
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311.15 USD
BS IEC 62899-201-2:2021
Printed electronics Materials. Substrates. Measurement methods for properties of stretchable substrates
Printed electronics Materials. Substrates. Measurement methods for properties of stretchable substrates
Released: 2022-04-06
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190.45 USD
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190.45 USD
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311.15 USD
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311.15 USD
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311.15 USD
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311.15 USD
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26.82 USD
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26.82 USD
25/30510920 DC
Draft BS EN 62899-202-12 Ed.1.0 Printed electronics : Materials. Rheological property measurement methods of inkjet ink for printed electronics
Draft BS EN 62899-202-12 Ed.1.0 Printed electronics : Materials. Rheological property measurement methods of inkjet ink for printed electronics
Released: 2025-02-25
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26.82 USD
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26.82 USD
25/30507775 DC
BS IEC 62899-202-14 Printed electronics Part 202-14: Materials - Test methods of conductive ink suitability for screen printing
BS IEC 62899-202-14 Printed electronics Part 202-14: Materials - Test methods of conductive ink suitability for screen printing
Released: 2024-12-20
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26.82 USD
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26.82 USD
English Secure PDF
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26.82 USD
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26.82 USD