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31.180 Printed circuits and boards
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BS IEC 62899-402-2:2020
Printed electronics Printability. Measurement of qualities. Edge waviness
Printed electronics Printability. Measurement of qualities. Edge waviness
Released: 2020-09-04
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183.28 EUR
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183.28 EUR
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183.28 EUR
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183.28 EUR
BS 123200:2001
System of quality assessment. Sectional specification. Rigid double-sided printed boards with plated-through holes
System of quality assessment. Sectional specification. Rigid double-sided printed boards with plated-through holes
Released: 2001-12-17
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183.28 EUR
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183.28 EUR
BS 123100-003:2001
System of quality assessment. Capability detail specification. Rigid single-sided and double-sided printed boards with plain holes
System of quality assessment. Capability detail specification. Rigid single-sided and double-sided printed boards with plain holes
Released: 2001-12-17
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299.28 EUR
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299.28 EUR
BS EN 61249-2-21:2003
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Released: 2004-02-16
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255.20 EUR
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255.20 EUR
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255.20 EUR
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255.20 EUR
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255.20 EUR
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255.20 EUR
24/30499551 DC
BS EN IEC 63516 Fixed folding durability test method for flexible opto-electric circuit boards
BS EN IEC 63516 Fixed folding durability test method for flexible opto-electric circuit boards
Released: 2024-08-23
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23.20 EUR
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23.20 EUR
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23.20 EUR
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23.20 EUR
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183.28 EUR
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183.28 EUR
BS IEC 63055:2023
Format for LSI-Package-Board Interoperable design
Format for LSI-Package-Board Interoperable design
Released: 2023-11-08
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382.80 EUR
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382.80 EUR
BS EN IEC 61189-2-801:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Thermal conductivity test for base materials
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Thermal conductivity test for base materials
Released: 2023-12-25
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183.28 EUR
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183.28 EUR