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>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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258 results
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BS EN 61249-4-16:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Released: 2009-10-31
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185.92 EUR
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PD IEC/TR 62878-2-2:2015
Device embedded substrate Guidelines. Electrical testing
Released: 2015-12-31
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185.92 EUR
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BS EN 61189-5-2:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering flux for printed board assemblies
Released: 2015-04-30
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342.72 EUR
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BS EN 61189-5-4:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
Released: 2015-04-30
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BS EN 62326-4:1997
Printed boards Rigid multilayer printed boards with interlayer connections. Sectional specification
Released: 1997-06-15
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304.64 EUR
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19/30357467 DC
BS IEC 62899-201-2. Printed electronics Part 201-2. Materials. Evaluation method of stretchable substrates
Released: 2019-05-13
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BS EN 61249-4-12:2005
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Non-halogenated multifuctional epoxide woven E-glass prepeg of defined flammability
Released: 2006-02-01
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DD IEC/PAS 61249-3-1:2007
Materials for printed boards and other interconnecting structures Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
Released: 2007-10-31
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BS EN IEC 62878-1:2019
Device embedding assembly technology Generic specification for device embedded substrates
Released: 2019-12-17
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BS EN IEC 61188-6-4:2019
Printed boards and printed board assemblies. Design and use Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
Released: 2019-07-12
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BS EN 61249-4-14:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Released: 2009-10-31
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BS EN 123400:1992
Harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards without through connections
Released: 1990-12-31
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259.84 EUR
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258 results
First page123...151617182022Last page