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Homepage>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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257 results
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BS CECC 23200-003:1996
Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plated through holes
Released: 1996-04-15
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255.20 EUR
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255.20 EUR
PD IEC/TR 62878-2-2:2015
Device embedded substrate Guidelines. Electrical testing
Released: 2015-12-31
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183.28 EUR
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183.28 EUR
BS EN 123000/Add:1997
Harmonized system of quality assessment for electronic components. Generic specification: printed boards
Released: 1997-08-15
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283.04 EUR
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283.04 EUR
BS EN 61249-2-35:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2009-04-30
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255.20 EUR
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255.20 EUR
BS EN 61188-5-5:2007
Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on four sides
Released: 2007-12-31
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336.40 EUR
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336.40 EUR
BS EN IEC 61189-5-503:2017
Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards
Released: 2018-04-13
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255.20 EUR
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255.20 EUR
BS EN IEC 61249-2-47:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2018-04-18
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255.20 EUR
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255.20 EUR
BS 123400-003:2001
System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections
Released: 2001-12-17
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299.28 EUR
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299.28 EUR
PD IEC TR 62878-2-7:2019
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
Released: 2019-04-01
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183.28 EUR
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183.28 EUR
BS EN 61249-4-14:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Released: 2009-10-31
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183.28 EUR
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183.28 EUR
BS EN 123400:1992
Harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards without through connections
Released: 1990-12-31
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255.20 EUR
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255.20 EUR
BS EN 61249-4-12:2005
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Non-halogenated multifuctional epoxide woven E-glass prepeg of defined flammability
Released: 2006-02-01
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183.28 EUR
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183.28 EUR
257 results
First page123...151617182022Last page