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>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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256 results
First page123...579...202122Last page
BS EN 123500:1992
Specification for harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards with through connections
Released: 1990-11-30
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288.96 EUR
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288.96 EUR
BS EN 61249-4-1:2008
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Epoxide woven E-glass prepreg of defined flammability
Released: 2008-07-31
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176.96 EUR
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176.96 EUR
BS IEC 62899-403-1:2018
Printed electronics Printability. Requirements for reproducibility. Basic patterns for evaluation of printing machine
Released: 2018-06-27
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246.40 EUR
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246.40 EUR
BS EN 61189-5-1:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
Released: 2016-10-31
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246.40 EUR
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BS EN 61188-5-4:2007
Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides
Released: 2007-12-31
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176.96 EUR
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BS EN 123500-800:1992
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections
Released: 1991-12-20
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176.96 EUR
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176.96 EUR
BS EN IEC 61249-2-46:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2018-04-16
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246.40 EUR
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246.40 EUR
BS EN IEC 61249-2-45:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2018-04-13
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246.40 EUR
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246.40 EUR
BS EN 16602-70-60:2019
Space product assurance. Qualification and Procurement of printed circuit boards
Released: 2019-07-19
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369.60 EUR
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369.60 EUR
BS EN IEC 61189-5-601:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
Released: 2021-03-19
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324.80 EUR
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324.80 EUR
BS EN IEC 61188-6-1:2021
Circuit boards and circuit board assemblies. Design and use Land pattern design. Generic requirements for land pattern on circuit boards
Released: 2021-04-07
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288.96 EUR
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288.96 EUR
BS EN 61249-2-38:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2009-06-30
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246.40 EUR
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246.40 EUR
256 results
First page123...579...202122Last page