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>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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256 results
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BS EN 61189-5-1:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
Released: 2016-10-31
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BS EN 123500:1992
Specification for harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards with through connections
Released: 1990-11-30
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BS EN 61249-4-1:2008
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Epoxide woven E-glass prepreg of defined flammability
Released: 2008-07-31
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BS EN 61249-2-38:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2009-06-30
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BS EN 61191-6:2010
Printed board assemblies Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods
Released: 2010-05-31
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BS 123800-003:2001
System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections
Released: 2001-12-17
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BS EN 61249-2-44:2016
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2016-07-31
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BS EN 123200:1992
Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plated through holes
Released: 1989-09-29
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BS EN 61249-2-41:2010
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2010-06-30
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PD IEC/PAS 61249-8-1:2014
Qualification and performance of electrical insulating compound for printed wiring assemblies
Released: 2014-06-30
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BS EN 61249-2-12:1999
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Epoxide non-woven aramid laminate of defined flammability, copper-clad
Released: 1999-06-15
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BS EN 62326-4-1:1997
Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification Capability detail specification. Performance levels, A, B and C
Released: 1997-06-15
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360.64 EUR
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256 results
First page123...579...202122Last page