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>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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256 results
First page123...579...202122Last page
PD IEC/TS 62878-2-3:2015
Device embedded substrate Guidelines. Design guide
Released: 2015-04-30
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246.40 EUR
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246.40 EUR
BS 4584-103.2:1990
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for copper foil for use in the manufacture of copper-clad base materials
Released: 1990-02-28
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150.08 EUR
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150.08 EUR
BS CECC 23600-801:1998
Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections
Released: 1998-06-15
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246.40 EUR
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246.40 EUR
BS EN 16602-70-60:2019
Space product assurance. Qualification and Procurement of printed circuit boards
Released: 2019-07-19
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369.60 EUR
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369.60 EUR
BS 6221-1:1990
Printed wiring boards Guide for the specification writer
Released: 1990-02-28
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150.08 EUR
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BS EN 61249-2-8:2003
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Reinforced base materials clad and unclad. Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Released: 2003-08-14
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246.40 EUR
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246.40 EUR
BS EN IEC 61249-2-46:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2018-04-16
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246.40 EUR
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246.40 EUR
BS EN IEC 61249-2-45:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2018-04-13
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246.40 EUR
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246.40 EUR
BS EN 61189-5-1:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
Released: 2016-10-31
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246.40 EUR
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246.40 EUR
BS EN 61188-5-4:2007
Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides
Released: 2007-12-31
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176.96 EUR
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176.96 EUR
BS EN 123500-800:1992
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections
Released: 1991-12-20
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176.96 EUR
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176.96 EUR
PD IEC/TR 63018:2015
Flexible printed circuit boards (FPCBs). Method to decrease signal loss by using noise suppression materials
Released: 2015-12-16
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176.96 EUR
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176.96 EUR
256 results
First page123...579...202122Last page