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>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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256 results
First page123...6810...202122Last page
BS EN 123300:1992
Specification for harmonized system of quality assessment for electronic components. Sectional specification. Multilayer printed boards
Released: 1989-08-31
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304.64 EUR
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304.64 EUR
BS IEC 62899-403-1:2018
Printed electronics Printability. Requirements for reproducibility. Basic patterns for evaluation of printing machine
Released: 2018-06-27
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259.84 EUR
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259.84 EUR
BS EN 61189-3:2008
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards)
Released: 2008-03-31
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389.76 EUR
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389.76 EUR
BS EN 16602-70-60:2019
Space product assurance. Qualification and Procurement of printed circuit boards
Released: 2019-07-19
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389.76 EUR
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BS 6221-1:1990
Printed wiring boards Guide for the specification writer
Released: 1990-02-28
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159.04 EUR
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159.04 EUR
BS EN 61249-2-8:2003
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Reinforced base materials clad and unclad. Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Released: 2003-08-14
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259.84 EUR
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BS EN IEC 61249-2-46:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2018-04-16
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259.84 EUR
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259.84 EUR
BS EN IEC 61249-2-45:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2018-04-13
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259.84 EUR
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259.84 EUR
BS EN IEC 61191-1:2018 - TC
Tracked Changes. Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Released: 2020-02-27
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481.60 EUR
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BS EN 61191-3:2017 - TC
Tracked Changes. Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
Released: 2020-02-26
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365.12 EUR
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BS EN IEC 61189-5-601:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
Released: 2021-03-19
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342.72 EUR
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BS EN IEC 61188-6-1:2021
Circuit boards and circuit board assemblies. Design and use Land pattern design. Generic requirements for land pattern on circuit boards
Released: 2021-04-07
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304.64 EUR
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256 results
First page123...6810...202122Last page