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31.190 Electronic component assemblies
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342.72 EUR
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BS EN 61189-1:1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods and methodology
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods and methodology
Released: 2002-06-21
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246.40 EUR
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PD IEC/TS 62878-2-4:2015
Device embedded substrate Guidelines. Test element groups (TEG)
Device embedded substrate Guidelines. Test element groups (TEG)
Released: 2015-04-30
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12/30262664 DC
BS EN 62588. Marking and Labeling of Components, PCBs and PCBAs to identify lead (Pb), lead-free (Pb-free) and other attributes
BS EN 62588. Marking and Labeling of Components, PCBs and PCBAs to identify lead (Pb), lead-free (Pb-free) and other attributes
Released: 2012-04-04
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BS EN 61191-2:2017
Printed board assemblies Sectional specification. Requirements for surface mount soldered assemblies
Printed board assemblies Sectional specification. Requirements for surface mount soldered assemblies
Released: 2019-10-07
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PD IEC/TS 62878-2-1:2015
Device embedded substrate Guidelines. General description of technology
Device embedded substrate Guidelines. General description of technology
Released: 2015-04-30
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BS EN 62137-1-4:2009
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic bending test
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic bending test
Released: 2009-03-31
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BS EN 61188-5-2:2003
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components
Released: 2003-10-16
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BS EN 61193-2:2007
Quality assessment systems Selection and use of sampling plans for inspection of electronic components and packages
Quality assessment systems Selection and use of sampling plans for inspection of electronic components and packages
Released: 2007-12-31
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BS EN 61190-1-2:2014
Attachment materials for electronic assembly Requirements for soldering pastes for high-quality interconnects in electronics assembly
Attachment materials for electronic assembly Requirements for soldering pastes for high-quality interconnects in electronics assembly
Released: 2014-06-30
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BS EN 62137-3:2012
Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints
Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints
Released: 2012-03-31
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324.80 EUR
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BS EN IEC 60068-2-82:2019
Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies
Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies
Released: 2019-07-12
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