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BS EN 62137-4:2014
Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
Released: 2015-06-30
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336.40 EUR
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183.28 EUR
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183.28 EUR
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336.40 EUR
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BS EN IEC 62878-2-5:2019
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
Released: 2019-11-18
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354.96 EUR
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PD IEC PAS 61191-10:2022
Printed board assemblies Application and utilization of protective coatings for electronic assemblies
Printed board assemblies Application and utilization of protective coatings for electronic assemblies
Released: 2022-09-13
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382.80 EUR
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BS EN IEC 60068-2-21:2021
Environmental testing Tests. Test U: Robustness of terminations and integral mounting devices
Environmental testing Tests. Test U: Robustness of terminations and integral mounting devices
Released: 2021-09-13
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336.40 EUR
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382.80 EUR
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382.80 EUR
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299.28 EUR
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BS EN 61869-3:2011
Instrument transformers Additional requirements for inductive voltage transformers
Instrument transformers Additional requirements for inductive voltage transformers
Released: 2012-03-31
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BS EN 61189-6:2006
Test methods for electrical materials, interconnection structures and assemblies Test methods for materials used in manufacturing electronic assemblies
Test methods for electrical materials, interconnection structures and assemblies Test methods for materials used in manufacturing electronic assemblies
Released: 2006-09-29
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299.28 EUR
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336.40 EUR
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BS EN 62739-3:2017
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Selection guidance of erosion test methods
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Selection guidance of erosion test methods
Released: 2017-04-30
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