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264.00 EUR
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264.00 EUR
23/30476409 DC
BS IEC 60947-10. Low-voltage switchgear and controlgear Part 10. Semiconductor Circuit-Breakers
BS IEC 60947-10. Low-voltage switchgear and controlgear Part 10. Semiconductor Circuit-Breakers
Released: 2023-07-05
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43.20 EUR
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43.20 EUR
24/30488515 DC
BS EN IEC 62047-50. Semiconductor devices. Micro-electromechanical devices Part 50. MEMS capacitive microphone
BS EN IEC 62047-50. Semiconductor devices. Micro-electromechanical devices Part 50. MEMS capacitive microphone
Released: 2024-03-05
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24.00 EUR
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24.00 EUR
23/30481371 DC
BS EN IEC 62047-4 Semiconductor devices. Micro-electromechanical devices Part 4. Generic specification for MEMS
BS EN IEC 62047-4 Semiconductor devices. Micro-electromechanical devices Part 4. Generic specification for MEMS
Released: 2023-10-20
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24.00 EUR
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24/30488096 DC
BS EN IEC 62031 LED modules. Safety requirements
BS EN IEC 62031 LED modules. Safety requirements
Released: 2024-04-12
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24.00 EUR
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24.00 EUR
BS IEC 62951-8:2023
Semiconductor devices. Flexible and stretchable semiconductor devices Test method for stretchability, flexibility, and stability of flexible resistive memory
Semiconductor devices. Flexible and stretchable semiconductor devices Test method for stretchability, flexibility, and stability of flexible resistive memory
Released: 2023-01-24
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189.60 EUR
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189.60 EUR
BS IEC 62047-37:2020
Semiconductor devices. Micro-electromechanical devices Environmental test methods of MEMS piezoelectric thin films for sensor application
Semiconductor devices. Micro-electromechanical devices Environmental test methods of MEMS piezoelectric thin films for sensor application
Released: 2023-04-05
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BS CECC 50000:1987
Harmonized system of quality assessment for electronic components. Generic specification: discrete semiconductor devices
Harmonized system of quality assessment for electronic components. Generic specification: discrete semiconductor devices
Released: 1987-10-30
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396.00 EUR
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396.00 EUR
BS EN 62047-9:2011
Semiconductor devices. Micro-electromechanical devices Wafer to wafer bonding strength measurement for MEMS
Semiconductor devices. Micro-electromechanical devices Wafer to wafer bonding strength measurement for MEMS
Released: 2013-01-31
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264.00 EUR
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264.00 EUR
BS EN 62047-22:2014
Semiconductor devices. Micro-electromechanical devices Electromechanical tensile test method for conductive thin films on flexible substrates
Semiconductor devices. Micro-electromechanical devices Electromechanical tensile test method for conductive thin films on flexible substrates
Released: 2014-10-31
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160.80 EUR
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160.80 EUR
BS IEC 60747-14-2:2000
Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors Hall elements
Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors Hall elements
Released: 2001-05-15
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189.60 EUR
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189.60 EUR
BS IEC 62047-36:2019
Semiconductor devices. Micro-electromechanical devices Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
Semiconductor devices. Micro-electromechanical devices Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
Released: 2019-04-24
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189.60 EUR
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189.60 EUR