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BS EN 62047-2:2006
Semiconductor devices. Micro-electromechanical devices Tensile testing method of thin film materials
Semiconductor devices. Micro-electromechanical devices Tensile testing method of thin film materials
Released: 2006-11-30
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181.45 USD
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181.45 USD
BS EN 62047-3:2006
Semiconductor devices. Micro-electromechanical devices Thin film standard test piece for tensile testing
Semiconductor devices. Micro-electromechanical devices Thin film standard test piece for tensile testing
Released: 2006-11-30
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153.34 USD
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153.34 USD
BS EN 62047-4:2010
Semiconductor devices. Micro-electromechanical devices Generic specification for MEMS
Semiconductor devices. Micro-electromechanical devices Generic specification for MEMS
Released: 2010-11-30
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253.00 USD
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253.00 USD
BS EN 62047-5:2011
Semiconductor devices. Micro-electromechanical devices RF MEMS switches
Semiconductor devices. Micro-electromechanical devices RF MEMS switches
Released: 2013-04-30
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296.45 USD
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296.45 USD
BS EN 62047-6:2010
Semiconductor devices. Micro-electromechanical devices Axial fatigue testing methods of thin film materials
Semiconductor devices. Micro-electromechanical devices Axial fatigue testing methods of thin film materials
Released: 2010-04-30
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181.45 USD
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181.45 USD
BS EN 62047-7:2011
Semiconductor devices. Micro-electromechanical devices MEMS BAW filter and duplexer for radio frequency control and selection
Semiconductor devices. Micro-electromechanical devices MEMS BAW filter and duplexer for radio frequency control and selection
Released: 2011-08-31
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296.45 USD
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296.45 USD
BS EN 62047-8:2011
Semiconductor devices. Micro-electromechanical devices Strip bending test method for tensile property measurement of thin films
Semiconductor devices. Micro-electromechanical devices Strip bending test method for tensile property measurement of thin films
Released: 2011-06-30
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181.45 USD
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181.45 USD
BS EN 62047-9:2011
Semiconductor devices. Micro-electromechanical devices Wafer to wafer bonding strength measurement for MEMS
Semiconductor devices. Micro-electromechanical devices Wafer to wafer bonding strength measurement for MEMS
Released: 2013-01-31
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253.00 USD
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253.00 USD
BS EN 62258-1:2010
Semiconductor die products Procurement and use
Semiconductor die products Procurement and use
Released: 2010-11-30
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334.78 USD
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334.78 USD
BS EN 62258-2:2011
Semiconductor die products Exchange data formats
Semiconductor die products Exchange data formats
Released: 2011-07-31
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380.78 USD
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380.78 USD
BS EN 62258-5:2006
Semiconductor die products Requirements for information concerning electrical simulation
Semiconductor die products Requirements for information concerning electrical simulation
Released: 2006-11-30
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181.45 USD
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In stock
181.45 USD
BS EN 62258-6:2006
Semiconductor die products Requirements for information concerning thermal simulation
Semiconductor die products Requirements for information concerning thermal simulation
Released: 2006-11-30
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153.34 USD
English Hardcopy
In stock
153.34 USD