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BS EN 61191-3:2017
Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
Released: 2017-09-25
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264.48 EUR
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189.24 EUR
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189.24 EUR
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BS IEC 62899-201:2016+A1:2018
Printed electronics Materials. Substrates
Printed electronics Materials. Substrates
Released: 2019-01-03
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348.84 EUR
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348.84 EUR
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189.24 EUR
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PD IEC/TS 62878-2-1:2015
Device embedded substrate Guidelines. General description of technology
Device embedded substrate Guidelines. General description of technology
Released: 2015-04-30
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310.08 EUR
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310.08 EUR
BS EN 60079-27:2008
Explosive atmospheres Fieldbus intrinsically safe concept (FISCO)
Explosive atmospheres Fieldbus intrinsically safe concept (FISCO)
Released: 2008-07-31
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189.24 EUR
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264.48 EUR
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BS EN 61249-5-4:1997
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings Conductive inks
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings Conductive inks
Released: 1997-05-15
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189.24 EUR
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PD IEC/PAS 61249-8-5:2014
Qualification and performance specification of permanent solder mask and flexible cover materials
Qualification and performance specification of permanent solder mask and flexible cover materials
Released: 2014-06-30
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264.48 EUR
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264.48 EUR
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BS 6221-6:1982
Printed wiring boards Specification for multilayer printed wiring boards
Printed wiring boards Specification for multilayer printed wiring boards
Released: 1982-01-29
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