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Homepage>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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257 results
1345678...202122Last page
BS EN 62326-20:2016
Printed boards Printed circuit boards for high-brightness LEDs
Released: 2016-05-31
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367.20 EUR
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367.20 EUR
BS EN 61249-2-37:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2009-04-30
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264.00 EUR
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264.00 EUR
BS EN 61249-4-11:2005
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Non-halogenated epoxide woven E-glass prepeg of defined flammability
Released: 2006-02-01
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189.60 EUR
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189.60 EUR
BS EN 61188-5-2:2003
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components
Released: 2003-10-16
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367.20 EUR
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367.20 EUR
BS EN 60097:1993
Specification for grid systems for printed circuits
Released: 1993-04-15
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160.80 EUR
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160.80 EUR
BS EN 61249-4-15:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Released: 2009-10-31
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189.60 EUR
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189.60 EUR
PD IEC/TS 62878-2-1:2015
Device embedded substrate Guidelines. General description of technology
Released: 2015-04-30
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309.60 EUR
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309.60 EUR
BS EN 61188-5-3:2007
Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on two sides
Released: 2007-12-31
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264.00 EUR
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264.00 EUR
BS 123700-003:2001
System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections
Released: 2001-12-17
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264.00 EUR
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264.00 EUR
BS EN 61249-4-17:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Released: 2009-10-31
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189.60 EUR
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In stock
189.60 EUR
PD IEC/PAS 61249-8-5:2014
Qualification and performance specification of permanent solder mask and flexible cover materials
Released: 2014-06-30
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264.00 EUR
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264.00 EUR
BS EN 61249-2-26:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Released: 2005-10-07
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264.00 EUR
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264.00 EUR
257 results
1345678...202122Last page