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>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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256 results
1345678...202122Last page
BS EN 61249-3-5:1999
Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) Transfer adhesive films for flexible printed boards
Released: 1999-06-15
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176.96 EUR
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BS CECC 200025:1998
Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities
Released: 1998-08-15
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288.96 EUR
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288.96 EUR
BS EN 61249-2-13:1999
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Cyanate ester non-woven aramid laminate of defined flammability, copper-clad
Released: 1999-06-15
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BS EN 61189-1:1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods and methodology
Released: 2002-06-21
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246.40 EUR
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PD IEC/TS 62878-2-4:2015
Device embedded substrate Guidelines. Test element groups (TEG)
Released: 2015-04-30
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BS EN 61249-3-4:1999
Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) Adhesive coated flexible polyimide film
Released: 1999-06-15
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BS EN 61191-3:2017
Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
Released: 2017-09-25
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246.40 EUR
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BS EN 62326-20:2016
Printed boards Printed circuit boards for high-brightness LEDs
Released: 2016-05-31
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342.72 EUR
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BS EN 61249-2-37:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2009-04-30
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BS EN 61249-4-11:2005
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Non-halogenated epoxide woven E-glass prepeg of defined flammability
Released: 2006-02-01
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BS 123700-003:2001
System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections
Released: 2001-12-17
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BS EN 61188-5-2:2003
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components
Released: 2003-10-16
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342.72 EUR
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256 results
1345678...202122Last page