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>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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256 results
First page123...91113...202122Last page
BS EN 61086-1:2004
Coatings for loaded printed wire boards (conformal coatings) Definitions, classification and general requirements
Released: 2004-05-17
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150.08 EUR
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BS EN 61249-2-10:2003
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Released: 2006-08-31
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246.40 EUR
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246.40 EUR
BS EN 60191-6-16:2007
Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Released: 2007-07-31
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150.08 EUR
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BS EN 61249-2-2:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Released: 2006-06-30
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176.96 EUR
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176.96 EUR
BS EN 61754-20-100:2012
Fibre optic interconnecting devices and passive components. Fibre optic connector interfaces Interface standard for LC connectors with protective housings related to IEC 61076-3-106
Released: 2012-09-30
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246.40 EUR
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BS EN 61189-5-3:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering paste for printed board assemblies
Released: 2015-04-30
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324.80 EUR
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BS EN 61249-3-3:1999
Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) Adhesive coated flexible polyester film
Released: 1999-06-15
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176.96 EUR
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176.96 EUR
BS EN 61249-5-1:1996
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings Copper foils (for the manufacture of copper-clad base materials)
Released: 1996-09-15
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BS EN 61249-8-7:1997
Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Marking legend inks
Released: 1997-03-15
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176.96 EUR
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176.96 EUR
BS CECC 23300-801:1998
Harmonized system of quality assessment for electronic components. Capability detail specification: multi-layer printed boards
Released: 1998-06-15
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288.96 EUR
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288.96 EUR
BS 123300:2001
System of quality assessment. Sectional specification. Rigid multilayer printed boards
Released: 2001-12-17
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176.96 EUR
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BS EN 61249-4-5:2005
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad Polymide, modified or unmodified, woven E-glass prepeg of defined flammability
Released: 2006-02-01
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176.96 EUR
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176.96 EUR
256 results
First page123...91113...202122Last page