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259.84 EUR
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259.84 EUR
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259.84 EUR
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22.40 EUR
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22.40 EUR
BS EN 62878-1-1:2015
Device embedded substrate Generic specification. Test methods
Device embedded substrate Generic specification. Test methods
Released: 2015-07-31
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360.64 EUR
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BS EN 61249-2-2:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Released: 2006-06-30
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BS EN 61249-8-7:1997
Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Marking legend inks
Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Marking legend inks
Released: 1997-03-15
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BS EN 61188-1-2:1998
Printed boards and assemblies. Design and use. Generic requirements Generic requirements. Controlled impedance
Printed boards and assemblies. Design and use. Generic requirements Generic requirements. Controlled impedance
Released: 1998-12-15
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304.64 EUR
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PD IEC TR 61191-7:2020
Printed board assemblies Technical cleanliness of components and printed board assemblies
Printed board assemblies Technical cleanliness of components and printed board assemblies
Released: 2020-03-23
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389.76 EUR
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389.76 EUR
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259.84 EUR
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BS IEC 62899-402-3:2021
Printed electronics Printability. Measurement of qualities. Voids in printed pattern using a two-dimensional optical image
Printed electronics Printability. Measurement of qualities. Voids in printed pattern using a two-dimensional optical image
Released: 2021-04-22
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PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Released: 2022-08-23
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