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Homepage>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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257 results
First page123...101214...202122Last page
BS 123600:2001
System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections
Released: 2001-12-17
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299.28 EUR
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BS EN 61249-4-5:2005
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad Polymide, modified or unmodified, woven E-glass prepeg of defined flammability
Released: 2006-02-01
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183.28 EUR
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DD IEC/PAS 62326-7-1:2007
Performance guide for single- and double-sided flexible printed wiring boards
Released: 2007-06-29
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336.40 EUR
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336.40 EUR
BS EN 61249-2-1:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
Released: 2005-08-09
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183.28 EUR
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BS EN 61188-5-8:2008
Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA)
Released: 2008-05-30
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299.28 EUR
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BS EN 61249-4-2:2005
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Multifunctional expoxide woven E-glass prepeg of defined flammability
Released: 2006-02-01
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183.28 EUR
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183.28 EUR
PD IEC TR 61189-5-506:2019
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
Released: 2019-07-18
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255.20 EUR
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PD IEC TR 61191-7:2020
Printed board assemblies Technical cleanliness of components and printed board assemblies
Released: 2020-03-23
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382.80 EUR
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BS EN IEC 61188-6-2:2021
Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for the most common surface mounted components (SMD)
Released: 2021-03-19
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255.20 EUR
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BS EN IEC 61189-5-501:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Surface insulation resistance (SIR) testing of solder fluxes
Released: 2021-03-12
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255.20 EUR
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PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Released: 2022-08-23
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183.28 EUR
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BS EN IEC 63203-406-1:2022
Wearable electronic devices and technologies Test method for measuring surface temperature of wrist-worn wearable electronic devices while in contact with human skin (IEC 63203-406-1:2021)
Released: 2022-05-10
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183.28 EUR
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257 results
First page123...101214...202122Last page