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25/30507775 DC
BS IEC 62899-202-14 Printed electronics Part 202-14: Materials - Test methods of conductive ink suitability for screen printing
BS IEC 62899-202-14 Printed electronics Part 202-14: Materials - Test methods of conductive ink suitability for screen printing
Released: 2024-12-20
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22.40 EUR
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22.40 EUR
BS EN IEC 61189-2-805:2024
Test methods for electrical materials, printed boards and other interconnection structures and assemblies X/Y CTE test for thin base materials by TMA
Test methods for electrical materials, printed boards and other interconnection structures and assemblies X/Y CTE test for thin base materials by TMA
Released: 2024-05-30
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159.04 EUR
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159.04 EUR
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22.40 EUR
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22.40 EUR
BS EN 62129-2:2011
Calibration of wavelength/optical frequency measurement instruments Michelson interferometer single wavelength meters
Calibration of wavelength/optical frequency measurement instruments Michelson interferometer single wavelength meters
Released: 2011-07-31
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360.64 EUR
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360.64 EUR
BS EN 60194:2006
Printed board design, manufacture and assembly. Terms and definitions
Printed board design, manufacture and assembly. Terms and definitions
Released: 2006-09-29
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389.76 EUR
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389.76 EUR
BS EN 61191-4:2017
Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies
Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies
Released: 2017-11-20
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259.84 EUR
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259.84 EUR
BS IEC 62899-202-5:2018
Printed electronics Materials. Conductive ink. Mechanical bending test of a printed conductive layer on an insulating substrate
Printed electronics Materials. Conductive ink. Mechanical bending test of a printed conductive layer on an insulating substrate
Released: 2018-10-09
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185.92 EUR
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185.92 EUR
BS EN 62496-4:2011
Optical circuit boards Interface standards. General and guidance
Optical circuit boards Interface standards. General and guidance
Released: 2011-03-31
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304.64 EUR
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304.64 EUR
BS EN 61249-2-11:2003
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Released: 2006-06-30
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259.84 EUR
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259.84 EUR
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304.64 EUR
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304.64 EUR
BS CECC 265001:1998
Harmonized system of quality assessment for electronic components. Technology approval schedule. Film and hybrid integrated circuits
Harmonized system of quality assessment for electronic components. Technology approval schedule. Film and hybrid integrated circuits
Released: 1999-07-15
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304.64 EUR
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304.64 EUR
BS CECC 23100-003:1996
Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plain holes
Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plain holes
Released: 1996-04-15
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259.84 EUR
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259.84 EUR