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PD IEC/TS 62878-2-4:2015
Device embedded substrate Guidelines. Test element groups (TEG)
Device embedded substrate Guidelines. Test element groups (TEG)
Released: 2015-04-30
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299.28 EUR
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299.28 EUR
English Secure PDF
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183.28 EUR
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183.28 EUR
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183.28 EUR
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183.28 EUR
BS CECC 200025:1998
Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities
Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities
Released: 1998-08-15
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299.28 EUR
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299.28 EUR
BS IEC 62899-204:2019
Printed electronics Materials. Insulator ink. Measurement methods of properties of insulator inks and printed insulating layers
Printed electronics Materials. Insulator ink. Measurement methods of properties of insulator inks and printed insulating layers
Released: 2019-06-07
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255.20 EUR
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255.20 EUR
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183.28 EUR
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183.28 EUR
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183.28 EUR
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183.28 EUR
PD IEC/PAS 61249-8-5:2014
Qualification and performance specification of permanent solder mask and flexible cover materials
Qualification and performance specification of permanent solder mask and flexible cover materials
Released: 2014-06-30
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255.20 EUR
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255.20 EUR
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255.20 EUR
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255.20 EUR
BS EN 60079-27:2008
Explosive atmospheres Fieldbus intrinsically safe concept (FISCO)
Explosive atmospheres Fieldbus intrinsically safe concept (FISCO)
Released: 2008-07-31
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183.28 EUR
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BS EN 61249-5-4:1997
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings Conductive inks
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings Conductive inks
Released: 1997-05-15
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BS IEC 62899-201:2016+A1:2018
Printed electronics Materials. Substrates
Printed electronics Materials. Substrates
Released: 2019-01-03
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354.96 EUR
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354.96 EUR