PRICES include / exclude VAT
31.180 Printed circuits and boards
CURRENCY
PRICES include / exclude VAT
Price include VAT will be charged for customers of European Union – non VAT payers.
Price exclude VAT will be charged for customers of European Union – VAT payers (with valid EU VAT number) and for customers outside of European Union.
Price exclude VAT will be charged for customers of European Union – VAT payers (with valid EU VAT number) and for customers outside of European Union.
BS EN 62496-1:2009
Optical circuit boards General
Optical circuit boards General
Released: 2009-07-31
English Secure PDF
Immediate download
Printable - You are authorized to print 1 copy
246.40 EUR
English Hardcopy
In stock
246.40 EUR
English Secure PDF
Immediate download
Printable - You are authorized to print 1 copy
288.96 EUR
English Hardcopy
In stock
288.96 EUR
English Secure PDF
Immediate download
Printable - You are authorized to print 1 copy
246.40 EUR
English Hardcopy
In stock
246.40 EUR
BS EN 61290-4-2:2011
Optical amplifiers. Test methods Gain transient parameters. Broadband source method
Optical amplifiers. Test methods Gain transient parameters. Broadband source method
Released: 2011-10-31
English Secure PDF
Immediate download
Printable - You are authorized to print 1 copy
246.40 EUR
English Hardcopy
In stock
246.40 EUR
BS EN 61290-11-2:2005
Optical amplifiers. Test methods Polarization mode dispersion parameter
Optical amplifiers. Test methods Polarization mode dispersion parameter
Released: 2005-08-19
English Secure PDF
Immediate download
Printable - You are authorized to print 1 copy
176.96 EUR
English Hardcopy
In stock
176.96 EUR
BS EN IEC 62878-1:2019
Device embedding assembly technology Generic specification for device embedded substrates
Device embedding assembly technology Generic specification for device embedded substrates
Released: 2019-12-17
English Secure PDF
Immediate download
Printable - You are authorized to print 1 copy
246.40 EUR
English Hardcopy
In stock
246.40 EUR
BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Released: 2021-08-20
English Secure PDF
Immediate download
Printable - You are authorized to print 1 copy
176.96 EUR
English Hardcopy
In stock
176.96 EUR
PD IEC TR 61191-8:2021
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Released: 2021-03-25
English Secure PDF
Immediate download
Printable - You are authorized to print 1 copy
288.96 EUR
English Hardcopy
In stock
288.96 EUR
English Secure PDF
Immediate download
Printable - You are authorized to print 1 copy
246.40 EUR
English Hardcopy
In stock
246.40 EUR
BS IEC 62899-202:2023 - TC
Tracked Changes. Printed electronics Materials. Conductive ink
Tracked Changes. Printed electronics Materials. Conductive ink
Released: 2023-06-08
English Secure PDF
Immediate download
Printable - You are authorized to print 1 copy
405.44 EUR
English Hardcopy
In stock
405.44 EUR
BS IEC 62899-202-4:2021
Printed electronics Materials. Conductive ink. Measurement methods for properties of stretchable printed layers (conductive and insulating)
Printed electronics Materials. Conductive ink. Measurement methods for properties of stretchable printed layers (conductive and insulating)
Released: 2021-12-24
English Secure PDF
Immediate download
Printable - You are authorized to print 1 copy
246.40 EUR
English Hardcopy
In stock
246.40 EUR
English Secure PDF
Immediate download
Printable - You are authorized to print 1 copy
22.40 EUR
English Hardcopy
In stock
22.40 EUR