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BS EN 123000/Add:1997
Harmonized system of quality assessment for electronic components. Generic specification: printed boards
Harmonized system of quality assessment for electronic components. Generic specification: printed boards
Released: 1997-08-15
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283.04 EUR
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283.04 EUR
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255.20 EUR
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255.20 EUR
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255.20 EUR
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255.20 EUR
BS 123400-003:2001
System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections
System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections
Released: 2001-12-17
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299.28 EUR
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299.28 EUR
PD IEC TR 62878-2-7:2019
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
Released: 2019-04-01
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183.28 EUR
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183.28 EUR
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336.40 EUR
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336.40 EUR
BS EN IEC 62878-1:2019
Device embedding assembly technology Generic specification for device embedded substrates
Device embedding assembly technology Generic specification for device embedded substrates
Released: 2019-12-17
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255.20 EUR
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255.20 EUR
PD IEC TR 61191-8:2021
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Released: 2021-03-25
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299.28 EUR
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299.28 EUR
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255.20 EUR
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255.20 EUR
BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Released: 2021-08-20
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183.28 EUR
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183.28 EUR
BS IEC 62899-202-4:2021
Printed electronics Materials. Conductive ink. Measurement methods for properties of stretchable printed layers (conductive and insulating)
Printed electronics Materials. Conductive ink. Measurement methods for properties of stretchable printed layers (conductive and insulating)
Released: 2021-12-24
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255.20 EUR
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255.20 EUR
PD IEC TS 62878-2-10:2024
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
Released: 2024-02-07
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155.44 EUR
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155.44 EUR