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>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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256 results
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BS EN IEC 61188-6-4:2019
Printed boards and printed board assemblies. Design and use Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
Released: 2019-07-12
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342.72 EUR
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342.72 EUR
BS EN 123000/Add:1997
Harmonized system of quality assessment for electronic components. Generic specification: printed boards
Released: 1997-08-15
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273.28 EUR
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273.28 EUR
BS EN IEC 61189-5-503:2017
Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards
Released: 2018-04-13
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259.84 EUR
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259.84 EUR
BS EN IEC 61249-2-47:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2018-04-18
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259.84 EUR
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BS 123400-003:2001
System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections
Released: 2001-12-17
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304.64 EUR
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304.64 EUR
BS EN IEC 62878-1:2019
Device embedding assembly technology Generic specification for device embedded substrates
Released: 2019-12-17
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259.84 EUR
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24/30491008 DC
BS EN IEC 61249-3-6. Materials for printed boards and other interconnecting structures Part 3-6. Sectional specification set for unreinforced base materials, clad and unclad - PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad
Released: 2024-04-10
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22.40 EUR
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24/30491435 DC
BS IEC 62899-402-2 Printed electronics Part 402-2: Printability - Measurement of qualities - Edge waviness of printed pattern using a two-dimensional optical image
Released: 2024-04-12
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22.40 EUR
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PD IEC TS 62878-2-10:2024
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
Released: 2024-02-07
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159.04 EUR
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PD IEC TR 62899-250:2025
Printed electronics Material technologies required in printed electronics for wearable smart devices
Released: 2025-03-17
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185.92 EUR
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BS EN IEC 61188-6-3:2025
Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for through hole components (THT)
Released: 2025-02-04
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304.64 EUR
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BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Released: 2021-08-20
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185.92 EUR
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256 results
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