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31.180 Printed circuits and boards
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BS EN 61249-2-22:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Released: 2005-08-24
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19/30357467 DC
BS IEC 62899-201-2. Printed electronics Part 201-2. Materials. Evaluation method of stretchable substrates
BS IEC 62899-201-2. Printed electronics Part 201-2. Materials. Evaluation method of stretchable substrates
Released: 2019-05-13
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22.40 EUR
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176.96 EUR
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DD IEC/PAS 61249-3-1:2007
Materials for printed boards and other interconnecting structures Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
Materials for printed boards and other interconnecting structures Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
Released: 2007-10-31
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246.40 EUR
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176.96 EUR
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BS EN IEC 62878-1:2019
Device embedding assembly technology Generic specification for device embedded substrates
Device embedding assembly technology Generic specification for device embedded substrates
Released: 2019-12-17
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24/30491435 DC
BS IEC 62899-402-2 Printed electronics Part 402-2: Printability - Measurement of qualities - Edge waviness of printed pattern using a two-dimensional optical image
BS IEC 62899-402-2 Printed electronics Part 402-2: Printability - Measurement of qualities - Edge waviness of printed pattern using a two-dimensional optical image
Released: 2024-04-12
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PD IEC TS 62878-2-10:2024
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
Released: 2024-02-07
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150.08 EUR
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PD IEC TR 62899-250:2025
Printed electronics Material technologies required in printed electronics for wearable smart devices
Printed electronics Material technologies required in printed electronics for wearable smart devices
Released: 2025-03-17
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BS EN IEC 61188-6-3:2025
Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for through hole components (THT)
Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for through hole components (THT)
Released: 2025-02-04
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BS IEC 62899-202-4:2021
Printed electronics Materials. Conductive ink. Measurement methods for properties of stretchable printed layers (conductive and insulating)
Printed electronics Materials. Conductive ink. Measurement methods for properties of stretchable printed layers (conductive and insulating)
Released: 2021-12-24
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