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31.180 Printed circuits and boards
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BS CECC 23300-003:1996
Harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards
Harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards
Released: 1996-04-15
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304.64 EUR
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304.64 EUR
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185.92 EUR
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185.92 EUR
BS EN 61193-1:2002
Quality assessment systems Registration and analysis of defects on printed board assemblies
Quality assessment systems Registration and analysis of defects on printed board assemblies
Released: 2002-05-14
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259.84 EUR
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259.84 EUR
PD IEC/TS 62878-2-3:2015
Device embedded substrate Guidelines. Design guide
Device embedded substrate Guidelines. Design guide
Released: 2015-04-30
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259.84 EUR
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BS IEC 62899-202-3:2019
Printed electronics Materials. Conductive ink. Measurement of sheet resistance of conductive films. Contactless method
Printed electronics Materials. Conductive ink. Measurement of sheet resistance of conductive films. Contactless method
Released: 2019-01-23
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185.92 EUR
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BS EN 62496-3:2011
Optical circuit boards Performance standards. General and guidance
Optical circuit boards Performance standards. General and guidance
Released: 2011-03-31
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185.92 EUR
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BS EN 61249-2-6:2003
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Released: 2006-08-31
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259.84 EUR
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259.84 EUR
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159.04 EUR
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159.04 EUR
PD IEC/TR 63018:2015
Flexible printed circuit boards (FPCBs). Method to decrease signal loss by using noise suppression materials
Flexible printed circuit boards (FPCBs). Method to decrease signal loss by using noise suppression materials
Released: 2015-12-16
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BS EN 61188-5-4:2007
Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides
Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides
Released: 2007-12-31
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185.92 EUR
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BS EN 123500-800:1992
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections
Released: 1991-12-20
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BS 123200-003:2001
System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes
System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes
Released: 2001-12-17
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304.64 EUR
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304.64 EUR