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>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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256 results
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BS EN 61249-2-44:2016
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2016-07-31
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BS EN 123200:1992
Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plated through holes
Released: 1989-09-29
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BS EN 61249-2-41:2010
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2010-06-30
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BS IEC 62899-403-1:2018
Printed electronics Printability. Requirements for reproducibility. Basic patterns for evaluation of printing machine
Released: 2018-06-27
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PD IEC/PAS 61249-8-1:2014
Qualification and performance of electrical insulating compound for printed wiring assemblies
Released: 2014-06-30
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BS EN 61189-3:2008
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards)
Released: 2008-03-31
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369.60 EUR
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BS IEC 62899-202-3:2019
Printed electronics Materials. Conductive ink. Measurement of sheet resistance of conductive films. Contactless method
Released: 2019-01-23
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176.96 EUR
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BS EN 62496-3:2011
Optical circuit boards Performance standards. General and guidance
Released: 2011-03-31
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BS EN 61249-2-6:2003
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Released: 2006-08-31
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BS CECC 23300-003:1996
Harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards
Released: 1996-04-15
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288.96 EUR
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BS CECC 23700-801:1998
Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid double-sided printed boards with through connections
Released: 1998-06-15
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BS EN 61193-1:2002
Quality assessment systems Registration and analysis of defects on printed board assemblies
Released: 2002-05-14
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256 results
First page123468...202122Last page