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PD IEC TR 61188-8:2021
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
Released: 2021-01-22
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185.92 EUR
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185.92 EUR
PD IEC TR 62878-2-8:2021
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Released: 2021-07-29
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185.92 EUR
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185.92 EUR
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22.40 EUR
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22.40 EUR
BS EN 62417:2010
Semiconductor devices. Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
Semiconductor devices. Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
Released: 2010-06-30
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159.04 EUR
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159.04 EUR
BS EN 62137-1-5:2009
Surface mounting technology. Environmental and endurance test methods for surface mount solder joints Mechanical shear fatigue test
Surface mounting technology. Environmental and endurance test methods for surface mount solder joints Mechanical shear fatigue test
Released: 2009-07-31
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259.84 EUR
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259.84 EUR
BS EN 61193-1:2002
Quality assessment systems Registration and analysis of defects on printed board assemblies
Quality assessment systems Registration and analysis of defects on printed board assemblies
Released: 2002-05-14
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259.84 EUR
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259.84 EUR
PD IEC/TS 62878-2-3:2015
Device embedded substrate Guidelines. Design guide
Device embedded substrate Guidelines. Design guide
Released: 2015-04-30
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259.84 EUR
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259.84 EUR
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481.60 EUR
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481.60 EUR
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259.84 EUR
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259.84 EUR
PD IEC TR 60068-3-15:2024
Environmental testing Supporting documentation and guidance. Vacuum-assisted reflow soldering
Environmental testing Supporting documentation and guidance. Vacuum-assisted reflow soldering
Released: 2024-04-08
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259.84 EUR
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25/30532202 DC
Draft BS EN IEC 61191-10-2 ED1 Circuit board assemblies Part 10-2 : Guideline for the Output Profile Design in Laser-Assisted Bonding
Draft BS EN IEC 61191-10-2 ED1 Circuit board assemblies Part 10-2 : Guideline for the Output Profile Design in Laser-Assisted Bonding
Released: 2025-08-04
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22.40 EUR
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24/30502381 DC
BS EN IEC 61760-4 Surface mounting technology Part 4: Classification, packaging, labelling and handling of moisture sensitive devices ED2
BS EN IEC 61760-4 Surface mounting technology Part 4: Classification, packaging, labelling and handling of moisture sensitive devices ED2
Released: 2024-10-18
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22.40 EUR
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