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31.190 Electronic component assemblies
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24/30502381 DC
BS EN IEC 61760-4 Surface mounting technology Part 4: Classification, packaging, labelling and handling of moisture sensitive devices ED2
BS EN IEC 61760-4 Surface mounting technology Part 4: Classification, packaging, labelling and handling of moisture sensitive devices ED2
Released: 2024-10-18
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23.20 EUR
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25/30532202 DC
Draft BS EN IEC 61191-10-2 ED1 Circuit board assemblies Part 10-2 : Guideline for the Output Profile Design in Laser-Assisted Bonding
Draft BS EN IEC 61191-10-2 ED1 Circuit board assemblies Part 10-2 : Guideline for the Output Profile Design in Laser-Assisted Bonding
Released: 2025-08-04
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BS EN 61188-1-2:1998
Printed boards and assemblies. Design and use. Generic requirements Generic requirements. Controlled impedance
Printed boards and assemblies. Design and use. Generic requirements Generic requirements. Controlled impedance
Released: 1998-12-15
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299.28 EUR
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299.28 EUR
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183.28 EUR
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183.28 EUR
BS EN 61760-4:2015+A1:2018
Surface mounting technology Classification, packaging, labelling and handling of moisture sensitive devices
Surface mounting technology Classification, packaging, labelling and handling of moisture sensitive devices
Released: 2020-06-16
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299.28 EUR
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BS EN 62421:2007
Electronics assembly technology. Electronic modules
Electronics assembly technology. Electronic modules
Released: 2007-12-31
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183.28 EUR
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BS EN 61193-3:2013
Quality assessment systems Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
Quality assessment systems Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
Released: 2013-06-30
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354.96 EUR
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354.96 EUR
BS EN 62878-1-1:2015
Device embedded substrate Generic specification. Test methods
Device embedded substrate Generic specification. Test methods
Released: 2015-07-31
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354.96 EUR
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BS EN 62739-1:2013
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials without surface processing
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials without surface processing
Released: 2013-09-30
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BS EN 61190-1-1:2002
Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly
Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly
Released: 2002-08-16
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255.20 EUR
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255.20 EUR
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23.20 EUR
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23.20 EUR
English Secure PDF
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255.20 EUR
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255.20 EUR