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Homepage>BSI Standards >31 ELECTRONICS>31.190 Electronic component assemblies

31.190 Electronic component assemblies

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82 results
First page12467Last page
PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Released: 2022-08-23
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183.28 EUR
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183.28 EUR
PD IEC TR 61191-7:2020
Printed board assemblies Technical cleanliness of components and printed board assemblies
Released: 2020-03-23
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382.80 EUR
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382.80 EUR
BS EN IEC 60068-2-82:2019 - TC
Tracked Changes. Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies
Released: 2020-02-24
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419.92 EUR
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BS EN IEC 61190-1-3:2018 - TC
Tracked Changes. Attachment materials for electronic assembly Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Released: 2020-02-27
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470.96 EUR
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BS EN IEC 60068-2-88:2025
Environmental testing Tests. Test XD: Resistance of components and assemblies to liquid cleaning media
Released: 2025-08-12
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299.28 EUR
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25/30510987 DC
Draft BS EN 61249-2-55 Materials for printed boards and other interconnecting structures Part 2-55. Reinforced base materials clad and unclad. Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad
Released: 2025-07-21
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23.20 EUR
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BS EN IEC 62878-2-603:2025
Device embedding assembly technology Guideline for stacked electronic module. Test method of intra-module electrical connectivity
Released: 2025-04-16
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183.28 EUR
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183.28 EUR
BS EN 62739-2:2016
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials with surface processing
Released: 2016-10-31
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183.28 EUR
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183.28 EUR
BS EN IEC 61190-1-3:2018
Attachment materials for electronic assembly Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Released: 2018-03-28
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336.40 EUR
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336.40 EUR
BS EN 62090:2017
Product package labels for electronic components using bar code and two- dimensional symbologies
Released: 2017-07-31
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299.28 EUR
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299.28 EUR
BS EN 62129-2:2011
Calibration of wavelength/optical frequency measurement instruments Michelson interferometer single wavelength meters
Released: 2011-07-31
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354.96 EUR
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354.96 EUR
BS EN 60939-2-2:2004
Complete filter units for radio interference suppression Blank detail specification. Passive filter units for electromagnetic interference suppression. Filters for which safety tests are required (safety tests only)
Released: 2005-02-08
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183.28 EUR
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183.28 EUR
82 results
First page12467Last page