Log inSign up
LANGUAGE en
Menu
STOREHelp centerContactsDelivery chargesABOUT US News
SEARCH
0
Total price
0 EUR
PRICES include / exclude VAT
>BSI Standards >31 ELECTRONICS>31.190 Electronic component assemblies

31.190 Electronic component assemblies

CURRENCY
PRICES include / exclude VAT
Price include VAT will be charged for customers of European Union – non VAT payers.
Price exclude VAT will be charged for customers of European Union – VAT payers (with valid EU VAT number) and for customers outside of European Union.
84 results
First page12467Last page
BS EN IEC 60068-2-88:2025
Environmental testing Tests. Test XD: Resistance of components and assemblies to liquid cleaning media
Released: 2025-08-12
English Secure PDF
Immediate download
Printable - You are authorized to print 1 copy
304.64 EUR
English Hardcopy
In stock
304.64 EUR
25/30510987 DC
Draft BS EN 61249-2-55 Materials for printed boards and other interconnecting structures Part 2-55. Reinforced base materials clad and unclad. Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad
Released: 2025-07-21
English Secure PDF
Immediate download
Printable - You are authorized to print 1 copy
22.40 EUR
English Hardcopy
In stock
22.40 EUR
BS EN IEC 62878-2-603:2025
Device embedding assembly technology Guideline for stacked electronic module. Test method of intra-module electrical connectivity
Released: 2025-04-16
English Secure PDF
Immediate download
Printable - You are authorized to print 1 copy
185.92 EUR
English Hardcopy
In stock
185.92 EUR
PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Released: 2022-08-23
English Secure PDF
Immediate download
Printable - You are authorized to print 1 copy
185.92 EUR
English Hardcopy
In stock
185.92 EUR
PD IEC TR 61191-7:2020
Printed board assemblies Technical cleanliness of components and printed board assemblies
Released: 2020-03-23
English Secure PDF
Immediate download
Printable - You are authorized to print 1 copy
389.76 EUR
English Hardcopy
In stock
389.76 EUR
21/30439434 DC
BS EN IEC 63215-5. Endurance test methods for die attach materials Part 5. Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices
Released: 2021-12-03
English Secure PDF
Immediate download
Printable - You are authorized to print 1 copy
22.40 EUR
English Hardcopy
In stock
22.40 EUR
BS EN IEC 60068-2-82:2019 - TC
Tracked Changes. Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies
Released: 2020-02-24
English Secure PDF
Immediate download
Printable - You are authorized to print 1 copy
427.84 EUR
English Hardcopy
In stock
427.84 EUR
BS EN IEC 61190-1-3:2018 - TC
Tracked Changes. Attachment materials for electronic assembly Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Released: 2020-02-27
English Secure PDF
Immediate download
Printable - You are authorized to print 1 copy
481.60 EUR
English Hardcopy
In stock
481.60 EUR
BS EN 61188-1-1:1997
Printed boards and assemblies. Design and use. Generic requirements Flatness considerations for electronic assemblies
Released: 1997-12-15
English Secure PDF
Immediate download
Printable - You are authorized to print 1 copy
159.04 EUR
English Hardcopy
In stock
159.04 EUR
BS EN 62137-4:2014
Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
Released: 2015-06-30
English Secure PDF
Immediate download
Printable - You are authorized to print 1 copy
342.72 EUR
English Hardcopy
In stock
342.72 EUR
BS EN 62739-2:2016
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials with surface processing
Released: 2016-10-31
English Secure PDF
Immediate download
Printable - You are authorized to print 1 copy
185.92 EUR
English Hardcopy
In stock
185.92 EUR
BS EN IEC 61190-1-3:2018
Attachment materials for electronic assembly Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Released: 2018-03-28
English Secure PDF
Immediate download
Printable - You are authorized to print 1 copy
342.72 EUR
English Hardcopy
In stock
342.72 EUR
84 results
First page12467Last page