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PD IEC/TR 62878-2-2:2015
Device embedded substrate Guidelines. Electrical testing
Device embedded substrate Guidelines. Electrical testing
Released: 2015-12-31
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176.96 EUR
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324.80 EUR
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BS EN 62137-1-2:2007
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Shear strength test
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Shear strength test
Released: 2007-10-31
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BS EN 62137-1-3:2009
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop test
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop test
Released: 2009-03-31
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246.40 EUR
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DD IEC/PAS 62588:2008
Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes
Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes
Released: 2008-10-31
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BS EN 62137-1-1:2007
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength test
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength test
Released: 2007-10-31
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BS EN 61869-3:2011
Instrument transformers Additional requirements for inductive voltage transformers
Instrument transformers Additional requirements for inductive voltage transformers
Released: 2012-03-31
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BS EN 61189-6:2006
Test methods for electrical materials, interconnection structures and assemblies Test methods for materials used in manufacturing electronic assemblies
Test methods for electrical materials, interconnection structures and assemblies Test methods for materials used in manufacturing electronic assemblies
Released: 2006-09-29
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288.96 EUR
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288.96 EUR
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324.80 EUR
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324.80 EUR
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324.80 EUR
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BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Released: 2021-08-20
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PD IEC TR 61191-8:2021
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Released: 2021-03-25
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