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PD IEC/TS 61967-3:2014
Integrated circuits. Measurement of electromagnetic emissions Measurement of radiated emissions. Surface scan method
Integrated circuits. Measurement of electromagnetic emissions Measurement of radiated emissions. Surface scan method
Released: 2014-09-30
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183.28 EUR
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BS EN 62132-3:2007
Integrated circuits. Measurement of electromagnetic immunity, 150 kHz to 1 GHz Bulk current injection (BCI) method
Integrated circuits. Measurement of electromagnetic immunity, 150 kHz to 1 GHz Bulk current injection (BCI) method
Released: 2007-11-30
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DD IEC/TS 62215-2:2007
Integrated circuits. Measurement of impulse immunity Synchronous transient injection method
Integrated circuits. Measurement of impulse immunity Synchronous transient injection method
Released: 2007-11-30
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BS IEC 63011-2:2018
Integrated circuits. Three dimensional integrated circuits Alignment of stacked dies having fine pitch interconnect
Integrated circuits. Three dimensional integrated circuits Alignment of stacked dies having fine pitch interconnect
Released: 2019-01-24
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BS CECC 63101:1985
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: film and hybrid integrated circuits
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: film and hybrid integrated circuits
Released: 1985-01-15
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BS IEC 60748-4-3:2006
Semiconductor devices. Integrated circuits Interface integrated circuits. Dynamic criteria for analogue-digital converters (ADC)
Semiconductor devices. Integrated circuits Interface integrated circuits. Dynamic criteria for analogue-digital converters (ADC)
Released: 2007-02-28
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BS IEC 60748-1:2002
Semiconductor devices. Integrated circuits General
Semiconductor devices. Integrated circuits General
Released: 2002-08-30
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BS QC 760000:1990
Harmonized system of quality assessment for electronic components. Film and hybrid film integrated circuits. Generic specification
Harmonized system of quality assessment for electronic components. Film and hybrid film integrated circuits. Generic specification
Released: 1990-04-30
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BS EN IEC 61967-4:2021
Integrated circuits. Measurement of electromagnetic emissions Measurement of conducted emissions. 1 Ω/150 Ω direct coupling method
Integrated circuits. Measurement of electromagnetic emissions Measurement of conducted emissions. 1 Ω/150 Ω direct coupling method
Released: 2021-05-06
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