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BS IEC 63011-2:2018
Integrated circuits. Three dimensional integrated circuits Alignment of stacked dies having fine pitch interconnect
Integrated circuits. Three dimensional integrated circuits Alignment of stacked dies having fine pitch interconnect
Released: 2019-01-24
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BS EN 62132-3:2007
Integrated circuits. Measurement of electromagnetic immunity, 150 kHz to 1 GHz Bulk current injection (BCI) method
Integrated circuits. Measurement of electromagnetic immunity, 150 kHz to 1 GHz Bulk current injection (BCI) method
Released: 2007-11-30
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DD IEC/TS 62215-2:2007
Integrated circuits. Measurement of impulse immunity Synchronous transient injection method
Integrated circuits. Measurement of impulse immunity Synchronous transient injection method
Released: 2007-11-30
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319.34 USD
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421.20 USD
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BS EN 190109:1994
Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated HC MOS circuits series HC/HCT/HCU
Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated HC MOS circuits series HC/HCT/HCU
Released: 1986-11-15
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BS EN IEC 61967-4:2021
Integrated circuits. Measurement of electromagnetic emissions Measurement of conducted emissions. 1 Ω/150 Ω direct coupling method
Integrated circuits. Measurement of electromagnetic emissions Measurement of conducted emissions. 1 Ω/150 Ω direct coupling method
Released: 2021-05-06
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21/30433680 DC
BS EN IEC 62228-7. Integrated circuits. EMC evaluation of transceivers Part 7. CXPI transceivers
BS EN IEC 62228-7. Integrated circuits. EMC evaluation of transceivers Part 7. CXPI transceivers
Released: 2021-02-05
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25/30511073 DC
Draft BS EN 62228-3 Ed.2.0 Integrated circuits. EMC evaluation of transceivers Part 3. CAN transceivers
Draft BS EN 62228-3 Ed.2.0 Integrated circuits. EMC evaluation of transceivers Part 3. CAN transceivers
Released: 2025-02-19
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