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BS IEC 63601:2026
Guideline for evaluating bias temperature instability of silicon carbide metal-oxide-semiconductor devices for power electronic conversion
Guideline for evaluating bias temperature instability of silicon carbide metal-oxide-semiconductor devices for power electronic conversion
Released: 2026-02-10
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403.20 USD
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BS IEC 62047-49:2025
Semiconductor devices. Micro-electromechanical devices Temperature and humidity test methods for piezoelectric MEMS cantilevers
Semiconductor devices. Micro-electromechanical devices Temperature and humidity test methods for piezoelectric MEMS cantilevers
Released: 2025-12-03
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187.11 USD
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187.11 USD
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218.73 USD
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BS IEC 62047-45:2025
Semiconductor devices. Micro-electromechanical devices Silicon based MEMS fabrication technology. Measurement method of impact resistance of nanostructures
Semiconductor devices. Micro-electromechanical devices Silicon based MEMS fabrication technology. Measurement method of impact resistance of nanostructures
Released: 2025-04-01
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24/30499672 DC
BS EN IEC 63550-2 Semiconductor devices - Neuromorphic devices Part 2: Evaluation method of linearity in memristor devices
BS EN IEC 63550-2 Semiconductor devices - Neuromorphic devices Part 2: Evaluation method of linearity in memristor devices
Released: 2024-08-30
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24/30500166 DC
BS EN IEC 63550-4 Semiconductor devices. Neuromorphic devices Evaluation method of asymmetry in neuromorphic memristor devices
BS EN IEC 63550-4 Semiconductor devices. Neuromorphic devices Evaluation method of asymmetry in neuromorphic memristor devices
Released: 2024-09-06
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BS IEC 62047-34:2019
Semiconductor devices. Micro-electromechanical devices Test methods for MEMS piezoresistive pressure-sensitive device on wafer
Semiconductor devices. Micro-electromechanical devices Test methods for MEMS piezoresistive pressure-sensitive device on wafer
Released: 2019-04-16
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BS IEC 62047-31:2019
Semiconductor devices. Micro-electromechanical devices Four-point bending test method for interfacial adhesion energy of layered MEMS materials
Semiconductor devices. Micro-electromechanical devices Four-point bending test method for interfacial adhesion energy of layered MEMS materials
Released: 2019-04-17
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BS IEC 62047-33:2019
Semiconductor devices. Micro-electromechanical devices MEMS piezoresistive pressure-sensitive device
Semiconductor devices. Micro-electromechanical devices MEMS piezoresistive pressure-sensitive device
Released: 2019-04-18
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305.69 USD
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BS EN 62047-8:2011
Semiconductor devices. Micro-electromechanical devices Strip bending test method for tensile property measurement of thin films
Semiconductor devices. Micro-electromechanical devices Strip bending test method for tensile property measurement of thin films
Released: 2011-06-30
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PD IEC/TR 62258-8:2008
Semiconductor die products EXPRESS model schema for data exchange
Semiconductor die products EXPRESS model schema for data exchange
Released: 2008-09-30
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BS EN 62047-12:2011
Semiconductor devices. Micro-electromechanical devices Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
Semiconductor devices. Micro-electromechanical devices Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
Released: 2011-11-30
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