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BS EN 62047-10:2011
Semiconductor devices. Micro-electromechanical devices Micro-pillar compression test for MEMS materials
Semiconductor devices. Micro-electromechanical devices Micro-pillar compression test for MEMS materials
Released: 2011-09-30
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222.64 USD
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222.64 USD
BS IEC 62830-2:2017
Semiconductor devices. Semiconductor devices for energy harvesting and generation Thermo power based thermoelectric energy harvesting
Semiconductor devices. Semiconductor devices for energy harvesting and generation Thermo power based thermoelectric energy harvesting
Released: 2017-08-10
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222.64 USD
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BS EN 62047-3:2006
Semiconductor devices. Micro-electromechanical devices Thin film standard test piece for tensile testing
Semiconductor devices. Micro-electromechanical devices Thin film standard test piece for tensile testing
Released: 2006-11-30
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190.45 USD
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BS IEC 60747-5-8:2019
Semiconductor devices Optoelectronic devices. Light emitting diodes. Test method of optoelectronic efficiencies of light emitting diodes
Semiconductor devices Optoelectronic devices. Light emitting diodes. Test method of optoelectronic efficiencies of light emitting diodes
Released: 2019-11-27
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222.64 USD
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BS EN IEC 60747-16-8:2022
Semiconductor devices Microwave integrated circuits. Limiters
Semiconductor devices Microwave integrated circuits. Limiters
Released: 2023-05-25
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364.80 USD
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BS EN IEC 60747-16-7:2022
Semiconductor devices Microwave integrated circuits. Attenuators
Semiconductor devices Microwave integrated circuits. Attenuators
Released: 2023-05-25
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410.40 USD
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410.40 USD
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222.64 USD
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222.64 USD
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211.91 USD
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211.91 USD
PD IEC TS 60747-19-2:2021
Semiconductor devices Smart sensors. Indication of specifications of sensors and power supplies to drive smart sensors for low power operation
Semiconductor devices Smart sensors. Indication of specifications of sensors and power supplies to drive smart sensors for low power operation
Released: 2021-07-02
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311.15 USD
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BS IEC 62047-38:2021
Semiconductor devices. Micro-electromechanical devices Test method for adhesion strength of metal powder paste in MEMS interconnection
Semiconductor devices. Micro-electromechanical devices Test method for adhesion strength of metal powder paste in MEMS interconnection
Released: 2021-07-07
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222.64 USD
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364.80 USD
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BS IEC 62047-40:2021
Semiconductor devices. Micro-electromechanical devices Test methods of micro-electromechanical inertial shock switch threshold
Semiconductor devices. Micro-electromechanical devices Test methods of micro-electromechanical inertial shock switch threshold
Released: 2021-09-14
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