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BS IEC 60747-5-13:2021+A1:2026
Semiconductor devices Optoelectronic devices. Hydrogen sulphide corrosion test for LED packages
Semiconductor devices Optoelectronic devices. Hydrogen sulphide corrosion test for LED packages
Released: 2026-02-06
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BS IEC 63602:2026
Guidelines for representing switching losses of SIC MOSFETs in datasheets
Guidelines for representing switching losses of SIC MOSFETs in datasheets
Released: 2026-02-26
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PD CLC/TR 62258-3:2007
Semiconductor die products Recommendations for good practice in handling, packing and storage
Semiconductor die products Recommendations for good practice in handling, packing and storage
Released: 2008-05-31
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414.00 USD
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BS EN 60745-1:2009+A11:2010
Hand-held motor-operated electric tools. Safety General requirements
Hand-held motor-operated electric tools. Safety General requirements
Released: 2011-02-28
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470.82 USD
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BS EN 60747-16-3:2002+A2:2017
Semiconductor devices Microwave integrated circuits. Frequency converters
Semiconductor devices Microwave integrated circuits. Frequency converters
Released: 2018-02-23
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BS EN 60464-2:2001
Varnishes used for electrical insulation Methods of test
Varnishes used for electrical insulation Methods of test
Released: 2007-02-28
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BS EN 60146-2:2000
Semiconductor convertors. General requirements and line commutated convertors Self-commutated semiconductor converters including direct d.c. converters
Semiconductor convertors. General requirements and line commutated convertors Self-commutated semiconductor converters including direct d.c. converters
Released: 2000-08-15
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BS EN 62374:2007
Semiconductor devices. Time dependent dielectric breakdown (TDDB) test for gate dielectric films
Semiconductor devices. Time dependent dielectric breakdown (TDDB) test for gate dielectric films
Released: 2008-10-31
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BS EN 62047-13:2012
Semiconductor devices. Micro-electromechanical devices Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
Semiconductor devices. Micro-electromechanical devices Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
Released: 2012-05-31
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BS EN 62047-15:2015
Semiconductor devices. Micro-electromechanical devices Test method of bonding strength between PDMS and glass
Semiconductor devices. Micro-electromechanical devices Test method of bonding strength between PDMS and glass
Released: 2015-07-31
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BS EN 62047-18:2013
Semiconductor devices. Micro-electromechanical devices Bend testing methods of thin film materials
Semiconductor devices. Micro-electromechanical devices Bend testing methods of thin film materials
Released: 2013-10-31
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