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>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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258 results
First page135678...202122Last page
BS IEC 62899-201:2016+A1:2018
Printed electronics Materials. Substrates
Released: 2019-01-03
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342.72 EUR
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342.72 EUR
BS EN 61249-4-11:2005
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Non-halogenated epoxide woven E-glass prepeg of defined flammability
Released: 2006-02-01
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185.92 EUR
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185.92 EUR
BS EN 61249-4-15:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Released: 2009-10-31
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185.92 EUR
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185.92 EUR
PD IEC/TS 62878-2-1:2015
Device embedded substrate Guidelines. General description of technology
Released: 2015-04-30
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304.64 EUR
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304.64 EUR
BS EN 61189-3-719:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
Released: 2016-04-30
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185.92 EUR
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BS EN 61249-4-17:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Released: 2009-10-31
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185.92 EUR
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185.92 EUR
PD IEC/PAS 61249-8-5:2014
Qualification and performance specification of permanent solder mask and flexible cover materials
Released: 2014-06-30
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259.84 EUR
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BS EN 61249-2-37:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2009-04-30
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259.84 EUR
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259.84 EUR
BS EN 61249-2-30:2013
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
Released: 2013-04-30
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259.84 EUR
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BS EN 61249-2-27:2013
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
Released: 2013-04-30
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259.84 EUR
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BS EN 61249-4-18:2013
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Released: 2014-02-28
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185.92 EUR
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PD IEC/TR 61189-3-914:2017
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines
Released: 2017-03-31
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258 results
First page135678...202122Last page