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31.190 Electronic component assemblies
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PD IEC TR 60068-3-12:2022
Environmental testing Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile
Environmental testing Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile
Released: 2022-11-30
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288.96 EUR
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BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Released: 2021-08-20
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PD IEC TR 61191-8:2021
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Released: 2021-03-25
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PD IEC TR 61760-5-1:2024
Surface mounting technology Surface strain on circuit board. Strain gauge measurement applied to chip components
Surface mounting technology Surface strain on circuit board. Strain gauge measurement applied to chip components
Released: 2024-02-07
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PD IEC TS 62878-2-10:2024
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
Released: 2024-02-07
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BS EN IEC 63215-2:2023
Endurance test methods for die attach materials Temperature cycling test method for die attach materials applied to discrete type power electronic devices
Endurance test methods for die attach materials Temperature cycling test method for die attach materials applied to discrete type power electronic devices
Released: 2023-12-05
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BS EN IEC 61188-6-3:2025
Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for through hole components (THT)
Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for through hole components (THT)
Released: 2025-02-04
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24/30498340 DC
BS EN IEC 61869-3 Instrument transformers Additional requirements for inductive voltage transformers
BS EN IEC 61869-3 Instrument transformers Additional requirements for inductive voltage transformers
Released: 2024-08-02
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